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Manufacturing/Packaging??

ChipMOS, CTJ ink tech transfer agreement

Posted: 11 Jul 2011 ?? ?Print Version ?Bookmark and Share

Keywords:packaging? LCD driver? assembly solutions?

ChipMOS Technologies Ltd has announced that its Taiwan-based subsidiary, ChipMOS Technologies Inc., has agreed to invest in Connectec Japan Corp. (CTJ). Under the share subscription agreement between the two companies, ChipMOS will put in 30 percent equity stake in CTJ.

ChipMOS and CTJ have also entered into a technology transfer agreement that will allow ChipMOS Taiwan to receive exclusive perpetual license for certain IP from CTJ. The agreement stated that ChipMOS Taiwan and CTJ will jointly develop package and assembly technologies aimed at market opportunities and to better address customer requirements.

CTJ is focused on the development of next generation semiconductor package and foundry technologies, the company said. Its proprietary technology was created to increase efficiency and yield of LCD driver assembly processes and to extend inner lead bonding process capability to below 20um.

"This is a milestone event for us," said Katsunori Hirata, president of CTJ. "We are excited to be working closely with ChipMOS in the future and together to develop more efficient and sophisticated semiconductor packaging technology."

"After carefully evaluating CTJ's technology, management and roadmap, we were so impressed by CTJ's achievements and capabilities that we agreed to take an equity stake in CTJ," stated S.J. Cheng, chair and CEO of ChipMOS. "Its next generation technology will allow ChipMOS to gain a competitive advantage by adopting technology improvements as we continuously work to lower process costs for our operations."





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