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Bonding system targets 450mm SOI wafers

Posted: 14 Jul 2011 ?? ?Print Version ?Bookmark and Share

Keywords:bonding system? wafer manufacturing? SOI wafers?

EV Group (EVG) has released a bonding system for 450mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. The EVG850SOI/450 mm builds on EVG's expertise in SOI wafer bonding. The system was created to support and facilitate the industry transition to 450mm wafers from the current 300mm standard.

Moore's Law has been the primary driver for innovation in the semiconductor industry for more than 40 years. The benefits of reduced cost per transistor, such as better performance and increased functionality, enable increased transistor budgets for innovative designs. Because IC cost per square centimeter (cost/cm2) approximately doubles each decade, the industry has undergone a coincident transition in wafer size every eight to 10 years in order to stay on the path of Moore's Law. This is while they continue to scale feature sizes.

SOI is expected to push the shift to 450mm, as it not only answers most of the scaling challenges, but it also delivers better power/performance for sub-22nm CMOS and 3D technologies compared to similar-geometry bulk CMOS.

Wafer bonding is a crucial technique for fabricating SOI wafers as it enables high-quality, single-crystal silicon films on one insulating layer to form SOI substrates.

The EVG850SOI/450mm wafer bonding system leverages EVG's strengths in wafer bonding technology to create a fully automated tool for production-level fabrication of SOI wafers. Moreover, because chipmakers will need an interim solution to optimize productivity for existing 300mm capacity as the migration to 450mm proceeds over the next few years, the system can serve as a bridge tool, allowing processing of both wafer sizes.

The EVG850SOI/450mm consists of two process modules: a cleaning module for cleaning and pre-conditioning of wafers before wafer bonding, and an SOI pre-bonding module. In the pre-bonding module, the two silicon wafers are joined together either in a vacuum or in an atmospheric chamber. The tool is equipped with 450mm load ports and front opening unified pods (FOUPs). Most of the particle and metal ion contamination tests will be performed on 300mm wafers due to the lack of 450mm metrology systems.

The EVG850SOI/450mm is the first tool in EVG's 450mm arsenal and will serve as the key starting point for the production of 450mm SOI wafers. It can also be used for developing other EV Group 450mm products, such as mask aligners and coating systems.





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