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MEMS production uses TSV

Posted: 14 Oct 2011 ?? ?Print Version ?Bookmark and Share

Keywords:TSV? MEMS? interconnect?

STMicroelectronics N.V. (ST) has declared a world's first in using through-silicon via (TSV) technology in high-volume MEMS production. TSV uses short vertical interconnects in ST's multichip MEMS devices instead of traditional wiring, allowing a higher level of functional integration and performance in a smaller form factor, said the company.

According to ST, TSV delivers greater space efficiency and higher interconnect density compared to wire bonding or flip chip stacking. Currently deployed in volume production, the ST-patented TSV technology helps shrink MEMS chip size while increasing its robustness and performance.

TSV tech

ST uses TSV in high-volume MEMS production.

"There is a great demand for smaller packages in the consumer market. ST's breakthrough implementation of TSV in MEMS devices opens a path to reduced footprints and increased functionality in mobile phones and other gadgets," stated Benedetto Vigna, corporate VP and general manager of ST's analog, MEMS and sensor group. "High-performance 3D-chip integration in our smart sensors and multiaxis inertial modules marks another important milestone in our mission to make MEMS ubiquitous in all facets of life."





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