Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Embedded
?
?
Embedded??

Peek inside iPhone 4S

Posted: 25 Oct 2011 ?? ?Print Version ?Bookmark and Share

Keywords:teardown? iPhone 4S?

UBM TechInsights got hold of the iPhone 4S when they hit stores last Friday (Oct. 14) and worked a preliminary teardown analysis.

What did we find? How does the iPhone 4S differ from the original iPhone 4 released in the summer of 2010? First is the design of a singular handset that will work across multiple carrier platforms such as GSM and CDMA. This was not a surprise, as such a capability was evident in the Verizon version of the iPhone 4. That version incorporated the first use of Qualcomm's MDM6600a chipset that was already capable of working across both GSM and CDMA mobile standards.

The foundation for a "world phone" was set, and UBM TechInsights' discovery of a Qualcomm MDM6610 confirmed our initial speculation that the Verizon iPhone 4 was precursor for this design change. Not only that, but it finalizes Apple's baseband supplier switch from Infineon to Qualcomm. Qualcomm was able to secure not only the design win of the MDM6610, but also the RTR8605 RF transceiver and their PM8028 power management device.

Another major winner is Broadcom. Not only did Broadcom maintain their socket from the iPhone 4, they convinced Apple to upgrade to one of their newer devices, the BCM4330 802.11n WiFi/Bluetooth/FM Radio chipset. This is the second major design win for Broadcom who saw the same IC incorporated in the popular Samsung Galaxy S II handset.

Cirrus Logic and Dialog Semiconductor also found their companies' products upgraded within the iPhone 4S. Apple selected the CLI1560B0 audio codec, moving from the CLI1495 that was in the iPhone 4. Apple also upgraded to Dialog's D1881A power management IC, moving from the D1815A in the previous handset.

The second biggest change from the iPhone 4 to the iPhone 4S is one that was telegraphed on the release of the iPad 2. The selection of the Apple A5 dual-core processor should come as no surprise to anyone familiar with Apple's tendency to use their tablet format as a precursor to a new processor. As the iPad's use of the A4 processor alluded to its use in the iPhone 4, the iPad 2 and the introduction of the A5 processor within its casing foretold its use in the iPhone 4S.

Here's Apple iPhone 4S front. (Click on image to enlarge)

Primary component listing
Primary iPhone 4S components:
- Apple A5 dual-core processor C package-on-package implementation
- Elpida B4064B2PF-8D-F CElpida 512 MB of low-power DDR2 DRAM (SI#26521)
- Qualcomm RTR8605 multimode RF transceiver
- AGD8 2132STMicroelectronics L3G4200DH 3-axis digital MEMS gyroscope module
- 33DHSTMicroelectronics LIS331DLH 3-axis MEMS accelerometer module
- Apple 338S0987 C Cirrus Logic CLI1560B0 audio codec
- TriQuint TQM9M9030 multimode quad-band power amplifier module
- TriQuint TQM666052 bias control power amplifier
- Avago ACPM-7381-TR1 UMTS2100 4x4 power amplifier
- Skyworks SKY 77464-20 load-insensitive power amplifier module for WCDMA/HSUPA bands
- Qualcomm MDM6610 baseband chipset solution
- Qualcomm PM8028 power management IC
- Apple 338S0973 C Dialog Semiconductor D1881A power management chip
- Toshiba THGVX1G7D2GLA08 16 GB MLC NAND flash memory
- Murata SW SS1919013 C wireless module featuring Broadcom BCM4330 MAC/baseband/radio with integrated bluetooth and FM transceiver

Here's Apple iPhone 4S back. (Click on image to enlarge)


1???2?Next Page?Last Page



Article Comments - Peek inside iPhone 4S
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top