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Sequans, Fujitsu offer next-gen LTE solution

Posted: 25 Oct 2011 ?? ?Print Version ?Bookmark and Share

Keywords:LTE solution? 2G? 3G? baseband chips?

Sequans Communications SA and Fujitsu Semicondcutor Ltd are collaborating to develop a new LTE solution. The two companies are combining Fujitsu's multimode 2G/3G/LTE RF solution with Sequans' next-generation LTE baseband chips.

The combined solution features Fujitsu's MB86L12A 2G/3G/LTE RF CMOS transceiver and Sequans' SQN3110 and SQN3120 baseband chips.

The MB86L12A supports all 3GPP LTE-FDD and LTE-TDD bands. The SQN3110 is Sequans' new 40nm LTE baseband chip that is 3GPP R9 compliant and it supports category 4 throughput at low power consumption. The SQN3120 adds an integrated applications processor for portable hotspots, hostless USB modems and CPE devices, according to Sequans.

The technical collaboration between the companies will focus on ensuring that the combined platform solution is optimized and is fully verified, and that customers can quickly move through the design and prototyping stage into production. Each company will maintain separate responsibility for price, availability and support of its respective products included in the combined platform.

Reference designs for multiple device types based on the combined Sequans/Fujitsu Semiconductor LTE solution are expected to be available from Sequans beginning later this year.





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