Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Rambus, ITRI team up for 3D packaging

Posted: 20 Dec 2011 ?? ?Print Version ?Bookmark and Share

Keywords:3D packaging? interposer technology? interconnect?

Rambus Inc. has announced that it is partnering with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies. The licensing company has stated that it will work with the research institute on the development of system integration using silicon interposer technology.

Rambus has also joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a research association led by ITRI. According to Rambus, the cooperation combines its capabilities in system, package and signaling design with ITRI's manufacturing and advanced process know-how.

"Collaborating with leading research institutions, such as ITRI, is an effective way for us to advance 3D packaging technology for the broader manufacturing community," noted John Kent, VP of technology development at Rambus. "Combining Rambus experience in high-performance system design and ITRI package research experience can enable new breakthroughs in 3D IC system integration and design."

"This collaboration brings together Rambus' advanced high-bandwidth and low-power device designs and ITRI's know-how in fabrication with our 12in equipment," indicated Ian Chan, VP and general director of the electronics and optoelectronics research laboratories at ITRI. "We expect to achieve some compelling and useful results through our joint efforts."





Article Comments - Rambus, ITRI team up for 3D packagin...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top