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Hybrid Memory Cube group adds ARM, HP, SK Hynix

Posted: 06 Jul 2012 ?? ?Print Version ?Bookmark and Share

Keywords:stacked memory? 3-D memory stacks? memory bandwidth?

Hewlett-Packard and SK Hynix have been added to the Hybird Memory Cube Consortium (HMCC) led by Micron and Samsung. With these additions, the proposed application of 3-D memory stacks has started to gain momentum.

The three companies, specializing in processors, computers and memory, have joined Altera, IBM, Microsoft, Open-Silicon, Xilinx as well as Micron and Samsung working to draft an open interface specification for stacked memory.

A primary goal of the HMCC is to be able to meet the memory bandwidth required for next-generation high-performance computers and networking equipment. Achieving such a task will require increased density and bandwidth at reduced power consumption.

HMCC plans to deliver a final interface specification by the end of 2012.

Peter Clarke
??EETimes US





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