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Laser spike anneal platform features ambient control

Posted: 24 Oct 2012 ?? ?Print Version ?Bookmark and Share

Keywords:ambient control? LSA201? LSA201LP? LSA201HP? laser spike anneal?

Ultratech Inc. has released a family of laser spike anneal (LSA) devices-LSA201, LSA201LP and LSA201HP-built on a platform that offers full-wafer ambient control processing for sub-20nm nodes. The LSA201 integrates Ultratech's patented micro-chamber design for achieving ambient control in a scanning system. According to the company, the system can run mixtures of any inert gases, but the general micro-chamber architecture is extendible to more exotic gases for future processes.

Traditional junction activation processes do not require ambient control. However, as devices scale below 20nm, Ultratech expects adoption of additional processes involving interface engineering and film property modification. Full-wafer ambient control is expected to become a critical capability for some of these types of processes. In Ultratech's design, a micro-chamber is formed around the wafer by bringing a stationary water-cooled plate close to the top of the wafer, and implementing a non-contact gas bearing around the perimeter of the wafer to make a seal with this plate. The micro-chamber is at atmospheric pressure, and does not require the complicated hardware associated with vacuum systems.

Like the LSA101 platform, there are also two dual-beam products based on the LSA201 platform: the LSA201LP, which features a second low-power beam for extension to low-temperature processing, and the LSA201HP, which features a second high-power beam for extension to longer dwell times. The LSA201LP targets middle-of-line (MOL) applications such as nickel silicide formation, and the LSA201HP targets advanced front-end-of-line (FEOL) applications such as defect annealing. A standard LSA201 system can be field upgraded to a LSA201LP or LSA201HP, enabling customers to extend their tool capabilities without switching to a new platform.

Ultratech's LSA201 LSA system built on the highly customisable Unity Platform includes a patented micro chamber for full-wafer, ambient control for processing at 14nm and below nodes. The micro chamber uses a nitrogen bearing for a non-contact solution and mass flow controllers (MFCs), which enable the use of other exotic gases. The LSA201 platform is field upgradable with all of Ultratech's dual-beam configurations for applications that require a low chuck temperature. The LSA201 is well suited for processes such as interface engineering and film property modification where ambient control is critical at 14nm and below. In addition, Ultratech's LSA201 can potentially be used for nickel silicide, high-k/metal gate and high-k annealing processes.

Ultratech plans to begin shipping LSA201 systems in 1H13, and already has customer commitments with the first shipment scheduled in 1Q13.





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