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Customised lenset array prepped for advanced e-beam tool

Posted: 08 Nov 2012 ?? ?Print Version ?Bookmark and Share

Keywords:lenset array? advanced e-beam tool? REBL technology? CMOS? MEMS?

Imec, a nano-electronic research company, has recently delivered a customised lenset array for KLA-Tencor's advanced e-beam tool. The company designed and fabricated an electrostatic micro-lens array for KLA-Tencor's Reflective Electron Beam Lithography (REBL) tool.

Rudi Cartuyvels, Imec's vice president for smart systems and energy technology, boasted that many companies can benefit from speciality semiconductor devices to enhance and increase the functionality of their equipment. He added that his company is pleased to lend support to the development of KLA-Tencor's REBL tool.

The REBL technology potentially enables a high throughput e-beam writing process for maskless lithography. The lenslet array is a key component for the parallelisation of the e-beam writing process. Functionality of the lenslet chip was demonstrated in KLA-Tencor's REBL e-beam column.

The lenslet consists of a densely packed array of 4?m deep cylindrical holes with a 1.4?m diameter and top spacing of only 200nm. The electron beam entering the lenslet holes is focused through a set of 4-ring electrodes. The ring electrodes can be tuned to focus the electron beams by applying static voltages up to 50V on the ring electrodes. The bottom of each hole consists of a small metal plate that can be switched by a CMOS circuitry below, either reflecting or absorbing the incoming electrons. In this way, the incoming electron beam is split into 1 million smaller beamlets, a strategy designed to enable higher throughput for the e-beam writing process through parallelisation.

Via its CMORE service, imec offers companies all the services need to develop packaged customised speciality microsystem products. Imec's services range from feasibility studies, design and technology development, testing and reliability studies, to prototyping and low-volume manufacturing. And through its alliances, imec can also offer a path to transfer the technology to a foundry for volume production. The CMORE tool-box contains a wide variety of device technologies on 200mm such as CMOS, Si-photonics, MEMS, speciality image sensors and packaging.

Visit imec at here.

- Julien Happich
??EE Times Europe





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