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InnoLas completes second 450mm system installation

Posted: 12 Apr 2013 ?? ?Print Version ?Bookmark and Share

Keywords:InnoLas Semiconductor? 450mm? wafers? Bridge-Tool Variant?

At the start of the year, sorting and laser marking systems developer InnoLas Semiconductor has successfully installed a second 450mm system. As an optional Bridge-Tool Variant, the system can mark 450mm and 300mm wafers on either side. The system checks the result, reducing the process operations significantly.

Wafers with a diameter of 450mm enable the chip industry with an increase in yield of up to 80 per cent. 'This leads to an enormous increase in productivity. In order to control the product quality these wafers receive a specific marking from the manufacturer.

"The marking and handling quality will be maintained at our high level for the new wafer sizes. To achieve this we use components developed in-house whenever the requirements are of high precision. These are otherwise not available in suitable quality as required by us and our customers" Andreas Behr, General Manager at InnoLas Semiconductor, explained.

Customers can choose between vacuum handling and edge-grip handling, both of which transport the wafers carefully and cleanly.

The company places particular emphasis on in-house developments and products in the application of high-precision components. Together with the robust development of proven engineering, these developments take care of the constant high quality standard in marking and handling processes.





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