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MediaTek smartphone platform touts dual-core HSPA+ SoC

Posted: 06 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:HSPA+ SoC? smartphone? Wi-Fi? FM? GPS?

MediaTek Inc. has released its next-generation dual-core smartphone platform that the company said is the world's first dual-core SoC with integrated Wi-Fi, FM, GPS and Bluetooth functions. Geared for the entry segment, the MT6572 also enables a cost-effective 4-layer PCB design. This cost-optimised, system-level design cuts BOM cost, eases product development and enhances time to market, noted the company.

Leveraging the technology breakthrough and market momentum of the flagship MT6589 quad-core HSPA+ platform, the MT6572 integrates a power-efficient dual-core Cortex-A7 CPU sub-system with speeds up to 1.2GHz in the 28nm process technology.

The mobile market continues the accelerated pace of transitioning to smartphones, with quarterly shipments already exceeding features phones for the first time. Most of the growth in smartphones is coming from the entry segment, both for emerging markets as consumers increasingly switch to entry Android devices and also for developed markets as operators drive deeper smartphone penetration and reduce device subsidies.

The MT6572 also integrates MediaTek's advanced multi-mode Rel. 8 HSPA+/TD-SCDMA modem, 3D graphics, support for up to HD 720p video playback and record, 5MP camera and up to qHD (960x540) displays. Supporting the leading picture quality technologies (MiraVision) inherited from MediaTek's extensive experience in the digital TV market, the MT6572 delivers an innovative solution that offers the finest visual quality and outstanding user experience desired by high-end smartphone owners.

The MediaTek MT6572 is available by June.





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