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Next-Gen EVG120 supports coating, developing apps

Posted: 09 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:EV Group? resist processing system? MEMS?

Wafer bonding and lithography equipment manufacturer EV Group recently debut the latest version of its EVG 120 automated resist processing system. The new system supports coating and developing applications for a variety of markets, including microelectromechanical systems (MEMS), advanced packaging and compound semiconductors. The flexible tool can also be configured with combined spin and spray coating modules.

The EVG120 automated resist processing system features a new robot with dual arms for fast wafer swapping and additional processing chambers, which result in enhanced throughput and overall productivity. To further optimise throughput and overall productivity, the new EVG120 runs the same EVG CIM Framework software as EVG's high-end XT Frame systems and offers full software integration with SECS/GEM standards. Two customisable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Like its predecessor, the EVG120 system can accommodate wafers up to 200mm in diameter.

Other new features of the EVG120 system include the company's innovative CoverSpin rotating bowl cover that allows improved coating uniformity across the substrate regardless of substrate shape. A new, temperature-controlled chuck further enhances EVG's proprietary OmniSpray coating technology, which specifically allows conformal coating of high-topography surfaces via its proprietary ultrasonic nozzle. OmniSpray coating is ideally suited for ultra-thin, fragile or perforated wafers and can result in an 80-per cent or greater reduction in material consumption compared to traditional spin coating.

Further improvements to serviceability and low CoO make the EVG120 system a versatile, high-quality production tool for an entry-level budget. The EVG120 system is ideally suited for a wide variety of markets and applications, including: high-topography coating and spray coating for MEMS; thick-film resists and bumping for advanced packaging; and passivation, dielectrics and thick-film processing for compound semiconductor devices.

More information about the updated EVG120 automated resist processing platform is available here.





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