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Laser spike anneal system boasts precise gas control

Posted: 21 Jun 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Ultratech? processing? Laser Spike Anneal System? interface engineering?

Ultratech recently announced the first shipment of its LSA201 system to a leading IDM. The LSA201 is built on a new platform that enables precise control over the gases that surround the wafer during processing. The system will be used to develop leading-edge logic technology, mainly focusing on FinFETs.

The LSA201 LSA system is built on the highly customisable Unity Platform and includes a micro chamber design that enables full-wafer ambient control in a scanning laser system. The micro chamber is a system which does not require the use of vacuum hardware. The current system is capable of running mixtures of any inert gases, but the micro-chamber architecture is extendible to more reactive gases for future processes.

The system targets middle-of-line (MOL) applications, such as silicide formation, and advanced front-end-of-line (FEOL) applications, such as defect annealing. The LSA201 is well suited for processes such as interface engineering and film property modification where ambient control is critical at sub-20nm.





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