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Sensors/MEMS??

Production test system reduces test costs for SoC devices

Posted: 10 Jul 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Teradyne? production test system? SoC? microcontrollers? image sensors?

Teradyne, Inc. recently announced the launch of their J750Ex-HD production test system. The system delivers cost of production test reductions with new capabilities tailored for testing Consumer SoC applications, including digital wafer sort, and final test of microcontrollers, image sensors and mobile connectivity devices.

J750Ex-HD includes system enhancements and new High Density (HD) instruments which can be used with over 4,000 J750 and IP750 installed test systems to run new and existing test programs. Capabilities for the J750Ex-HD include the HSD800 Multifunction Instrument, a third generation digital instrument providing 128 high speed digital channels, scalable to 2,048 channels per system.

The instrument also introduces DIB Access, a feature allowing unique tester resources including High Voltage and Digital Source and Signal Capture (DSSC) pins, to be easily connected without external hardware. DIB Access reduces load board complexity, shortening time-to-market and simplifying concurrent test to increase overall test cell throughput.

Other capabilities include a 72-channel HD CTO, a precision DC and analogue instrument with graphical programming templates and debug tools to simplify converter testing and other precision DC measurements, the IG-XL 3.60 Software, which extends push button program scalability to 512 sites, and a zero-footprint, air-cooled system. The System Architecture also maintains pin and program compatibility with existing J750Ex Device Programs.

Further information regarding the the J750 can be found here.





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