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TI rolls power chips with MIPI RFFE, maximise battery life

Posted: 28 Aug 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Texas Instruments? RF? power converters? LTE? smartphones?

Texas Instruments recently unveiled what it claims as the industry's first RF power converters to integrate the MIPI Alliance's radio frequency front-end (RFFE) digital control interface, a specification that simplifies multi-band and multi-radio communications. The highly efficient LM3263 buck converter and LM3279 buck-boost converter significantly reduce the heat and power consumption in RF power amplifiers, improving battery life and extending talk time in 2G, 3G and 4G LTE smartphones, tablets and data cards.

The LM3263 2.5A buck converter's average power tracking feature helps it meet stringent RF requirements of multi-mode, multi-band power amplifiers with fast output voltage transients. The device also includes active current assist and bypass to minimise inductor size without loss of output regulation, resulting in a 10mm2 solution, half the size of competing solutions. The LM3279 1A buck-boost regulator supports fast output voltage transients for 3G and 4G LTE. The device enables the amplifier to support high output power and high data rates, even at low battery voltages.

TI also introduced the LM8335 general output expander with MIPI RFFE host interface to complement the LM3263 and LM3279. The expander reduces the general-purpose input/output pin allocation and gives designers greater design flexibility to support up to eight additional analogue outputs that use analogue-controlled, non-MIPI RFFE compliant components.

Designers can test power and performance with the LM3263, LM3279 and LM8335 evaluation modules for 3G and 4G RF power amplifiers. The modules include all essential active and passive components to compare analogue and RFFE digital control modes of operation.

The LM3263 comes in a 2x2x0.6mm, 16-bump lead-free DSBGA package. The LM3279 buck-boost converter also comes in a 2x2.5x0.6mm, 16-bump lead-free DSBGA package. The LM8335 comes in a 2x2x0.6mm, 16-bump lead-free DSBGA package.





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