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Understanding plastic ball grid array

Posted: 18 Sep 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Plastic Ball Grid Array? PBGA? Texas Instruments? substrate? solder balls?

The Plastic Ball Grid Array or PBGA package, qualified and ramped by Texas Instruments Philippines is a cavity up laminate based substrate package in which the die is attached to the substrate in the normal die up manner. The wire-bonded device and the complete assembly is then overmolded and solder balls attached to form the package. This package provides a cost-effective packaging solution, offering higher density over traditional leadframe packages. Texas Instruments' design and simulation capabilities enable package optimisations needed for maximum electrical and thermal performance. The PBGA package is offered in a range of sizes from 17mm x 17mm to 35mm x 35mm, in ball pitch of 0.8mm and 1.0mm, to provide a ball count ranging from 208 to 976 balls. PBGA packages are available in 2 and 4 layer substrate designs.

View the PDF document for more information.

Originally published by Texas Instruments Inc. at www.ti.com as "Plastic Ball Grid Array (PBGA)".





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