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Soldering requirements for BQFN packages

Posted: 02 Oct 2014 ?? ?Print Version ?Bookmark and Share

Keywords:BQFN? reflow? IR soldering? verification? qualification testing?

BQFN devices are qualified to have no degradation from reflow/IR soldering and aqueous washing by verification through rigorous testing. Sample batches are subjected to three passes through a convection reflow oven and an aqueous wash cleaner, with a cool-down between passes to room temperature. The convection reflow oven is set to achieve 245C to 260C peak temperature on any pin or component. These parts are subsequently used for thermal shock, humidity, and life qualification testing. All products must pass this initial qualification testing with zero failures before being released to production.

View the PDF document for more information.

Originally published by Texas Instruments Inc. at www.ti.com as "Soldering Requirements for BQFN Packages".





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