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Attaching HotRod QFN package to PCB

Posted: 23 Oct 2014 ?? ?Print Version ?Bookmark and Share

Keywords:Quad flat no leads? QFNs? HotRod? copper leadframe? thermal performance?

Quad flat no leads (QFNs) HotRod is a thermally enhanced plastic package that uses new copper leadframe technology. It eliminates power device wire bonds by attaching the power device and/or die directly to the leadframe. This construction results in a cost effective advanced packaging that improves electrical and thermal performance over traditional leaded packages. The HotRod QFN also improves the application efficiency by eliminating wire bonds connection between the die and the leadframe and minimizes the package parasitic.

HotRod QFNs have solder lands on all sides as well as power buses for enhanced current caring capability. HotRod QNFs are available in number of formats and sizes. The package is molded and mechanically singulated from a matrix of leadframes. Package size is determined by the encapsulated die size, and number of signal pins.

View the PDF document for more information.

Originally published by Texas Instruments Inc. at www.ti.com as "HotRod QFN Package PCB Attachment".





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