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Thermal evaluation method for TLV62065

Posted: 05 Nov 2014 ?? ?Print Version ?Bookmark and Share

Keywords:thermal management? heat dissipaters? junction-temperature? thermal evaluation?

As power densities increase, the amount of heat generated on the silicon imposes significant challenges to thermal management. Temperature becomes a more dominant factor in device performance and reliability. Therefore, the meticulously assessment of the thermal-management design of each device is important of the device to perform safely under the intended operating conditions and environments.

However, thermal evaluation in the system-level of an electronic circuit board is generally a difficult task. This type of evaluation requires knowledge of the major heat dissipaters in the system, the environmental conditions, some theoretical calculations, and some amount of guesswork. Because of this guesswork and uncertainty, the tolerance on accurate junction-temperature measurement and prediction is typically poor. The purpose of this application report is to minimise the guesswork required and deliver a more accurate method of thermal evaluation.

View the PDF document for more information.

Originally published by Texas Instruments Inc. at www.ti.com as "An Accurate Thermal-Evaluation Method for the TLV62065".





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