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DLP high-resolution chipsets boost 3D printing applications

Posted: 06 Nov 2014 ?? ?Print Version ?Bookmark and Share

Keywords:DLP chipsets? 3D printing? lithography? digital micromirror devices?

Texas Instruments (TI) has introduced the DLP9000 and DLP6500 digital micromirror devices (DMDs), two high-resolution chipsets that target 3D printing, 3D machine vision and lithography applications. Each programmable by the DLPC900 controller, the chipsets boast of higher resolution imaging, extended wavelength support and faster pattern rates compared to previous devices.

The DLP9000 offers four million pixels, or a 2560-by-1600 micromirror array. It can be used to build large, advanced resolution objects in 3D printing and scan larger objects at longer throw distances. For cost-sensitive applications, the DLP6500 offers up to two million pixels, or a 1920-by-1080 (1080p) micromirror array. The chipsets have programmable pattern rates up to 9,500Hz and are optimised for wavelengths from 400nm to 700nm. Both are compatible with existing resins for 3D printing and resists for lithography applications.

The DLPC900 controller touts a convenient interface for reliable, high-speed control of the micromirrors. By using a single controller to support multiple DMDs, customers have the flexibility to design multiple high-performance systems using just one design iteration.

The DLP LightCrafter 9000 and DLP LightCrafter 6500 evaluation modules have standard USB, HDMI and I2C interfaces that allow developers to easily create designs for a variety of applications.

Available in volume from TI authorised distributors, DLP9000 comes in a 355-pin hermetic FLS package, while DLP6500 comes in 350-pin ceramic FYE and 203-pin hermetic FLQ packages. The DLPC900 controller is housed in a 516-pin BGA package. The DLP LightCrafter 9000 and DLP LightCrafter 6500 evaluation modules can be bought from the TI eStore.





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