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Fan-out wafer level packaging to reach $200 million, analysts say

Posted: 26 Feb 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Fan-out wafer level packaging market? embedded die?

Yole Dveloppement, a France-based market research and consulting firm, predicts that the Fan-Out Wafer Level Packaging (FOWLP) market will be in high-volume this year. According to its new report, "Fan-Out and Embedded Die: Technologies & Market," the FOWLP market may reach an estimated $200 million in 2015 and have 30 per cent CAGR in the following years.

Yole analysts expect the strong growth due to the arrival of 2nd generation FOWLP. More customers are also being convinced, a wider range of potential applications reached, and technology qualifications started during the transition phase completed by strong fabless players.

FOWLP started volume commercialisation in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications, essentially single die packages for cell phone base band chips. But this growth reached its limit in 2011. And in 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology.

FOWLP market in 2015

The Fan-Out Wafer Level Packaging (FOWLP) market is already in high volume and is expected to grow even more strongly per Yole Dveloppement analysts.

FOWLP faced strong competition from other packaging technologies such as wafer-level chip scale packaging (WLCSP) in 2013/2014. Intel Mobile also backed off from the technology, and the main manufacturers reduced their prices in 2014, creating a transition phase with low market growth.

What can explain such potential? Primarily, mobile customers have high expectations of miniaturisation and higher integration while keeping costs low. This leads naturally to WLP for cost and performance and system-in-package (SiP) solutions for integration and functionality. FOWLP has proven its ability to reach these targets. Its small form-factor and low cost potential shown in the first generation are now enhanced with high-integration capability of the second generation.

"Benefiting from the delay in introducing 3D through-silicon via (TSV) architectures, FOWLP is currently seen as the best fit for the highly demanding mobile/wireless market and is attractive for other markets focusing on high performance and small size," explained Jr?me Azemar, Yole Technology & Market Analyst, Advanced Packaging & Manufacturing.

Under this technology and market report, Yole provides a complete overview of the different market expectations and a detailed application-by-application breakdown. The company also describes the different strategies and products of each player involved in FOWLP, from the main outsourced assembly and test companies, like STATS ChipPAC and Nanium, to foundries like TSMC. Since cost is always the first driver, the report also focuses on equipment and material challenges and substrate size evolution, both for wafers and panels.





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