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RF/Microwave??

Weak mobile infrastructure opens opportunities for RF chips

Posted: 13 Aug 2015 ?? ?Print Version ?Bookmark and Share

Keywords:Mobile Experts? RF? mobile infrastructure? carrier aggregation?

Mobile Experts has unleashed its latest report that brings to light opportunities for the fragile mobile infrastructure market. The report provides detailed analysis of semiconductor components such as ASIC, FPGA, SoC, LDMOS, GaN, ADC, DAC, linearisation (DPD), PLL, VCO, and small signal RF devices. Transceivers are analysed for bandwidth, power level and other factors, and trends in ASICs with programmable cores and FPGA support are analysed in detail, noted the market research firm.

"The market is weak for macro mobile infrastructure in general, with China Mobile slowing down abruptly this year," explained Joe Madden, principal analyst at Mobile Experts. "New networks in India, China and the United States will pick up some slack but the overall macro spending profile will be flat for the next few years. Despite weakness at the base station level, high order MIMO and carrier aggregation are driving new remote radio head requirements that create growth opportunities for a few semiconductor components."

"This report identifies the bright spots in the semiconductor market, where wide bandwidth, carrier aggregation, and flexibility create opportunities for semiconductor features. This report provides the block diagrams and cost analysis which illustrates the clear reasons for movement toward new techniques."





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