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2014-03-14 Tunable laser expands system capacity in advanced optical networks
A*STAR IME and NTU claimed the smallest wavelength-tunable laser fabricated by MEMS technology and can generate light from 1531.2-1579.5nm of the near-infrared region.
2013-05-17 Taiwan amplifies microelectronics strength
Taiwan, long recognised for design automation, is pioneering innovations in human-computer interaction, medical electronics and resolution of pressing social issues with novel semiconductors.
2013-11-27 Singapore-Abu Dhabi R&D programme focuses on advanced MEMS
Singapore's EDB and the UAE's Advanced Technology Investment Company will fund 'Twin Lab,' a collaborative research project between A*STAR IME, Globalfoundries and the Masdar Institute of Science and Technology to develop advanced MEMS technologies
2007-04-20 ON Semi, Masaryk U open research lab in Czech Republic
ON Semiconductor and Masaryk University opened a new laboratory for academic education and both silicon technology and microelectronics research in Czech Republic
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies
2007-05-24 New UMC R&D lab zeroes in on advanced nanometer tech
UMC has opened a new R&D lab in Southern Taiwan focusing on advanced nanometer technologies for 300mm manufacturing
2009-09-04 Microelectronics center rises in Quebec
The Governments of Quebec and Canada gave a $178 million grant for a state-of-the-art microelectronics innovation center
2010-11-04 LAST POWER Project aims to develop advanced SiC and GaN semicon
The partners in a new publicly-funded European research project have just announced details of the multinational/multidisciplinary program called LAST POWER (Large Area silicon carbide Substrates and heTeroepitaxial GaN for POWER device applications
2002-10-11 IMEC to establish 300mm silicon research foundry
IMEC has laid its plans of setting up a 300mm silicon research platform initiative to perform advanced process research at least "two generations ahead of manufacturing.&quot
2012-06-18 IME, Rolls-Royce partner for advanced power converters
A*STAR is working with Rolls-Royce to develop GaN power devices that would measure various physical parameters at temperatures up to 300C and environmental pressure of up to 30kpsi.
2002-04-04 IBM, Sony and Toshiba to co-develop advanced chip processes
In a deal that will move SOI and other advanced semiconductor process technologies into cost-sensitive consumer electronics ICs, IBM, Sony Corp., Sony Computer Entertainment Inc. and Toshiba have signed a four-year process technology development agreement
2012-01-25 IBM, Globalfoundries to jointly manufacture advanced ICs
Globalfoundries Inc. and IBM Corp. has announced that they are going to jointly manufacture advanced computer chips at both companies' semiconductor fabs in New York's "Tech Valley
2014-05-19 IBM Research develops bone-strong, recyclable polymers
The researchers employed a 'computational chemistry' hybrid approach or a combination of high performance computing and synthetic polymer chemistry to predict how the molecules will respond.
2007-11-13 Freescale, China rail transport firm set up microelectronics lab
Freescale Semiconductor and China rail transportation company Zhuzhou CSR Times Electric have established a joint laboratory for microelectronics applications
2002-03-15 Consortium may take over Bell Labs research facility
Lucent Technologies and Agere Systems Inc. are attempting to spin-off their nanotechnology and electron-beam lithography lab in Murray Hill, N.J. as an advanced prototyping foundry that would be run by a consortium of local public and private investors
2015-06-30 CEA-Leti realigns research focus: FD-SOI takes centre stage
Leti, equipped with 200nm and 300nm wafer fabs, pioneered in its labs one of the key technologies in manufacturing SOI wafers, transferred it to Soitec, and worked with ST in chips based on FD-SOI.
2013-07-10 A*STAR IME consortium delve into advanced packaging
A*STAR IME and a group of semiconductor firms have teamed up to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics.
2010-11-17 SRC, ATIC extend tech research to Abu Dhabi
The Semiconductor Research Corp. extends its university research partnership to Abu Dhabi, via a program sponsored by the Advanced Technology Investment Co
2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors.
2005-07-08 Quarter-brick IBCs extend to 450W
Georgia Institute of Technology researchers have developed a chip-cooling process that they hope will replace the bulky, bolt-on metal towers used with microprocessors like the G5.
2007-11-29 Nanotechnology R&D flourishes in Israel
Nanotechnology R&D is growing rapidly in Israel, with 81 nanotechnology companies and 326 academic researchers in the country.
2002-07-29 CMC licenses ARM design technology
Canadian Microelectronics Corp. has joined the ARM University Program, and licensed an ARM SoC design and prototyping package
2002-06-19 Chip industry tackles escalating mask costs
The rapid increase in the cost of photomask sets for advanced IC processes has made a lot of news in recent months
2006-10-05 UMC, IME co-develop RF modeling for 90nm
United Microelectronics Corp. have partnered with Singapore's Institute of Microelectronics to jointly develop RF modeling solutions for 90nm technologies
2007-01-10 UMC's new 300mm fab to open in '08
United Microelectronics Corp. said it foresees opening a new 300mm wafer plant in 2008
2008-07-30 UMC signs up with Sematech consortium
United Microelectronics Corp. has joined the Sematech research consortium to work on R&D for exploratory technologies on 300mm wafers, including 22nm and beyond process generations
2002-02-12 UMC seeks control of Japan joint-venture fab
United Microelectronics Corp. is seeking to gain management control of its 300mm wafer joint venture with Hitachi Ltd, UMC chairman and chief executive Robert Tsao said Friday (Feb. 8
2006-01-18 UMC offers 90nm MPW service via Europractice
The Europractice IC service operated by the Interuniversities Microelectronics Center is now offering access to 90nm CMOS manufacturing on multiproject wafers from UMC
2004-01-26 TI builds 1GHz DSP in 90nm process
Setting marks in DSP speed and process geometry, Texas Instruments Inc. (TI) is sampling a 1GHz device built in a 90nm process.
2004-10-13 Synopsys opens design center in Dubai
Synopsys will open a dedicated facility for electronic design in the Emirate of Dubai, according to an announcement from the Dubai Silicon Oasis (DSO) technology organization.
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