Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > stacked microprocessor

stacked microprocessor Search results

?
?
total search13 articles
2008-10-01 Stacked microprocessor system promises better performance
Take a different approach to chill. A group of researchers just did, resulting in what may be the most efficient heat dissipation possible for stacked microprocessors
2007-10-04 Wavecom gives free MPU design licensing for service contract
Wavecom SA is hoping to drive its intelligent-management software and machine-to-machine embedded subsystems by offering its own microprocessor design free of charge with a service contract
2009-04-13 IBM Fellow sees end of Moore's Law
IBM Corp. Fellow Carl Anderson, who oversees physical design and tools in its server division, predicted during the recent International Symposium on Physical Design 2009 conference the end of continued exponential scaling down of the size and cost of semiconductors.
2014-02-25 ThruChip opts for wireless wafer stacking
ThruChip develops Japanese professor's technology in stacking silicon wafers, using a wireless approach that is cheaper than TSVs.
2008-05-16 Take your pick of NAND implementation
When considering the combination of requirements for a system's NAND budget, designers have several NAND implementation options, each with its own benefits and disadvantages.
2005-12-14 Samsung develops 8GB memory module
Samsung Electronics has developed a technology that allows it to modularize 32 pieces of a 2Gb DDR2 DRAM chip together with a logic chip to create a 8GB memory module for a server computer.
2012-05-10 Microsoft joins memory consortium
Microsoft's participation signals the potential of the Memory Cube to drive changes in the traditional memory hierarchy and systems software for computers and networks.
2008-07-15 iPhone 3G still packs some surprises
Aside from some very surprising component choices in key parts of the upgraded communications section, the old adage 'if it ain't broke, don't fix it' has clearly shaped the design of the iPhone 3G.
2007-08-15 Hynix licenses floating-body tech for future DRAM
Hynix has licensed the floating-body single-transistor memory technology from Innovative Silicon for use in future generations of DRAM chips.
2006-11-08 DSLAM controller enables triply-play services
TranSwitch has announced a feature-rich DSLAM controller optimized to transport Ethernet and ATM traffic for next-generation IP-DSLAM equipment to enable bandwidth intensive triple-play services.
2008-12-16 DRAM adopts better features
Samsung Electronics Co. Ltd's 56nm DRAM is something to watch out for. Changes to the basic transistor design for both the cell access transistor in the memory array and the peripheral support transistors used to design the control logic are in the works.
2006-07-27 Avago display touts 'first' blue characters in thin package
Avago touts its new LED alphanumeric display as the industry's first smart display with eye-catching blue characters in a thin rectangular 8-character package.
2013-04-01 Add multi-cell battery system to single-cell designs
Front-end power management units will unite multi-cell battery stack designs of future systems and single-cell-based designs of past systems.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top