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Applied advocates TSV adoption
Posted:?Aug 23, 2011 0:30 AM

Applied Materials Inc. announced that it is leading a major effort to enable the widespread adoption...[ View complete article ]


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Applied advocates TSV adoption

Posted:? Aug 23, 2011 0:30 AM
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Applied Materials Inc. announced that it is leading a major effort to enable the widespread adoption of through-silicon vias (TSVs), a rapidly-emerging approach for vertically stacking ICs to boost chip performance and functionality in a smaller area.
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(1) Reply:Applied advocates TSV adoption Posted:? Aug 23, 2011 0:30 AM
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Author:1280958691259

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Great overview-would be nice to have more details on how and how much this reduces power. Would be good to compare to intel's 3D transistor approach which I believe they claimed only added 5% to cost over standard device architecture.
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