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Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package
Posted:?Mar 16, 2013 7:45 PM

This application note addresses low-cost, four- to six-layer, high-volume PCB layout for a Spartan-3...[ View complete article ]


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Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package

Posted:? Mar 16, 2013 7:45 PM
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This application note addresses low-cost, four- to six-layer, high-volume PCB layout for a Spartan-3E FPGA in the FT256 1mm BGA package. The impact of highspeed signals and signal integrity (SI) considerations for low layer count PCB layouts is also reviewed. This application note is intended for design engineers, managers and PCB layout staff, who are already familiar with SI related design issues. It focuses on the Spartan-3E device in the FT256 package, but the information applies to the equivalent FG256 package, and the general guidelines can be used to optimize board layout for other devices and packages.
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(1) Reply: Four- and six-layer, high-speed PCB design Posted:? Nov 8, 2013 2:11 PM
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http://pcb.hqew.net/?s=544849 Huaqiang PCB offers online“Price Calculator? for you having a rough idea on the cost of your PCB project quickly.
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