Pressure cyclic purge (PCP) technology developed by Semiconductor Research Corp. could give Intel and other SRC members a leg up on next-generation semiconductor nodes. There has been a concerted effort to make the chemicals and gases more environmentally friendly and to shorten the downtime between process steps.

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PCP has shown potential to cut the ultra-high-purity gases needed in semiconductor manufacturing by 20 per cent and the time needed to purge semiconductor gas distribution systems between chip fab steps by 30 per cent. Full story here.
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