Description
Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
Responsibilities may include:
-Establishment and documentation of thermal/mechanical/electrical related specifications including:?Technology Target Specification (TTS),?Technology Performance Specification (TPS), and Enabling Design Requirement Document (EDRD) design.
-Modeling/simulation, and analysis of package.
-Enabling thermal/mechanical design, design evaluation and characterization, metrology development, design prototype construction and checkout, modification and evaluation of package and/or enabling design, reviewing product requirements, planning and organizing routine design and analysis projects or phases of projects.
-Responds to customer/client requests or events as they occur.
-Uses judgment in data analysis to develop and design solutions for moderately complex processes.
?
http://jobs.intel.com/mobile/job/Penang-PackageBallmap-Design-&-Development-Engineer-Job/64228600/