Job description
- Develop SOC for IOT
- Participate all phases of IC front-end design, including:
- Architecture design
??????? ??? - ?RTL design
??????? ??? - Create or modify test bench
??????? ??? - RTL and gate level simulation
??????? ??? - FPGA emulation
??????? ??? - Timing closure review
??????? ??? - Power analysis
- Technical documentation
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Requirements
- MS with 3 years of experience
- Strong verbal and written communication
- Experience of SRAM/ROM/ or analogue macro integration
- Experience of timing closure report analysis
- Experience of communication with top tier customers
- Ability of co-work with back-end physical design team for chip tape out
- Ability of problem solving, continue and steadily working until goal accomplished is a must
- Knowledge of shell script, Perl and makefile
- Experience of playing a role as team leader or coordinator
- Willing to be involved in chip bring-up testing and ATE pattern preparation
- Willing to provide technical documentation
- Experience of USB 2.0 PHY or Link Layer is a plus
- Experience of chip bring-up testing and ATE pattern preparation is a plus
- Knowledge of communication systems and MODEM/MAC is a plus
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https://jobs.broadcom.com/job/Hsinchu-Engineer%2C-Sr-Staff-IC-Design-HSQ-300/281335800/