Jobs Wanted
Message: ?????Development Engineer, Die Attach -- Malaysia, Infineon
Posted:Nov 10, 2015 6:09 PM
Author:jsolana

Job description

- Support new product/ package development and deliver results according to project time line

- Monitor performance, quality and reliability of process during development stage.

- Identify problems or unfavourable deviations; design, recommend and execute/implement corrective/improvement actions which enhance the utility, quality, reliability or cost effectiveness in the area of responsibility.

- Reading and writing technical reports, and maintaining appropriate records of developed process.

- Initiating and generating IP ideas based on reading and research.

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Requirements

- Bachelor's Degree in Mechanical Engineering, Electrical & Electronic Engineering, Process Engineering, IT / Computer Science & Computer Engineering.

- Minimum 4 years¡¯ experience in semiconductor industry preferably in die attach process.

- Analytical and problem solving skills (FMEA, RCA, DMAIC, 8D Methodology, etc.)???

- Design of Experiment (DoE)???

- Analytical equipment knowledge (smart scope, hisomet, SAT, etc.)???

- Strong hands-on knowledge in assembly particularly at die attach process.

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https://recruitingapp-2721.de.umantis.com/Vacancies/9803/Description/2?lang=eng

This post from EE Times Asia Forum:
http://forum.eetasia.com/FORUM_POST_1000039357_1200289667_0.HTM
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