2008-10-21-31 Article review

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Article review (Sorted By Date)

FAQs: CAN (2008-10-31) [ Networks ]
PC manufacturers recall more Sony batteries (2008-10-31) [ Embedded ]
High-speed debugger rolls for MCUs, DSCs (2008-10-31) [ Embedded ]
LCD TV design solution achieves 90% efficiency (2008-10-31) [ EDA/IP ]
Buck regulator supports up to 24V (2008-10-31) [ Power/Alternative Energy ]

Chip tech meets HDMI specs for multimedia apps (2008-10-31) [ Interface ]
Circuit breaker delivers better switching overload (2008-10-31) [ Power/Alternative Energy ]
Audio DSP ensures high-capacity, complex designs (2008-10-31) [ Processors/DSPs ]
MCU sharply reduces power, processing requirements (2008-10-31) [ Controls/MCUs ]
Ziptronix heralds 3-D chip stacking technique (2008-10-31) [ EDA/IP ]

Rumor surfaces TSMC sought to acquire Chartered (2008-10-31) [ Manufacturing/Packaging ]
Atmel junks 'devalued' bid of Microchip, ON Semi (2008-10-31) [ Manufacturing/Packaging ]
Intel to showcase 32nm technology at confab (2008-10-31) [ EDA/IP ]
SMIC gets export license for 32nm products (2008-10-31) [ Manufacturing/Packaging ]
Mosaid, Powerchip end DRAM patent feud (2008-10-31) [ Memory/Storage ]

Qualcomm hit with new $1B GPS patent suit (2008-10-31) [ RF/Microwave ]
NXP's 150mm fab in France is up for sale (2008-10-31) [ Manufacturing/Packaging ]
Future casts a dreary outlook for industry (2008-10-31) [ Manufacturing/Packaging ]
Numonyx widens presence in embedded NOR (2008-10-30) [ Memory/Storage ]
Toshiba readies 43nm SLC NAND flash (2008-10-30) [ Memory/Storage ]

Advanced Simulink tool delivers customized designs (2008-10-30) [ EDA/IP ]
Bluetooth modules ease integration in embedded designs (2008-10-30) [ RF/Microwave ]
Boost regulators supply up to 1.2A switch current (2008-10-30) [ Power/Alternative Energy ]
3V pressure sensors suit handheld mobile apps (2008-10-30) [ Sensors/MEMS ]
Agilent touts enhancements to X-Series signal analyzers (2008-10-30) [ T&M ]

Latest Blackfin DSPs proclaim high performance (2008-10-30) [ Processors/DSPs ]
Consumer navigation faces long road to mass market (2008-10-30) [ RF/Microwave ]
U.S. court junks Nichia claims vs. Seoul Semi (2008-10-30) [ EDA/IP ]
Intel Capital invests in China cleantech firms (2008-10-30) [ Power/Alternative Energy ]
New IC test group consolidates ATE standards (2008-10-30) [ T&M ]

Gartner sees dimming future for OEMs (2008-10-30) [ Manufacturing/Packaging ]
Opinion: Tech longs for R&D backing, not simply cash (2008-10-30) [ Manufacturing/Packaging ]
Immersion, Samsung ink TouchSense license pact (2008-10-30) [ Optoelectronics/Displays ]
TI to shed about 350 jobs in France (2008-10-30) [ Manufacturing/Packaging ]
PCI Express virtualization—using a resource that isn't there (2008-10-29) [ Interface ]

Opinion: India achieves another milestone (2008-10-29) [ EDA/IP ]
Comment: Microchip's takeover bid on Atmel a 'smart move' (2008-10-29) [ Manufacturing/Packaging ]
GooglePhone responds to Android's aspirations (2008-10-29) [ EDA/IP ]
iSuppli: HDTVs to hit 241.2M units by 2012 (2008-10-29) [ Optoelectronics/Displays ]
Qualcomm grants module/modem license to Foxlink (2008-10-29) [ RF/Microwave ]

Fujitsu, Nokia Siemens partner to drive LTE services in Japan (2008-10-29) [ RF/Microwave ]
LDK Solar's wafers go to Italy (2008-10-29) [ Manufacturing/Packaging ]
Samsung's quarterly earnings suffer setback (2008-10-29) [ Manufacturing/Packaging ]
Compact audio codec improves capacity of portables (2008-10-29) [ Processors/DSPs ]
Low-cost processor works with multiple connections (2008-10-29) [ Controls/MCUs ]

Reference tool hastens production of media devices (2008-10-29) [ EDA/IP ]
PCIe frame grabber supports up to 3.2Gbit/s data transfer (2008-10-29) [ Interface ]
Test option rolls for capacitors in aviation apps (2008-10-29) [ T&M ]
10bit ADCs claim lowest power consumption (2008-10-29) [ Amplifiers/Converters ]
DC/DC converter extends flexibility options (2008-10-29) [ Power/Alternative Energy ]

Cypress positions CyFi for embedded apps (2008-10-29) [ RF/Microwave ]
FAQs: Battery Management (2008-10-28) [ Power/Alternative Energy ]
Micro Power Stations—You Too Can Be a Utility Company (2008-10-28) [ Power/Alternative Energy ]
TRIAC optocouplers lower standby power up to 2W (2008-10-28) [ Optoelectronics/Displays ]
Touchscreen controller ICs detect simultaneous taps (2008-10-28) [ Interface ]

LDOs meet power demands of portable apps (2008-10-28) [ Power/Alternative Energy ]
Carrier board enables direct flash integration (2008-10-28) [ Memory/Storage ]
Amp protects circuit connection from overvoltage (2008-10-28) [ Amplifiers/Converters ]
Ontario's first fuel cell to produce ultraclean energy (2008-10-28) [ Power/Alternative Energy ]
Tiny ESD protection device suits up for speedy data lines (2008-10-28) [ Amplifiers/Converters ]

Express Logic, Renesas ready MP3 platform (2008-10-28) [ Embedded ]
WiMAX market sees high growth in India (2008-10-28) [ RF/Microwave ]
LG turns panel plant to solar cell production line (2008-10-28) [ Manufacturing/Packaging ]
Renesas taps Epson A-GPS tech for SH-Mobile G3 LSIs (2008-10-28) [ RF/Microwave ]
Outlook: Semi's situation is not yet like 2001 (2008-10-28) [ EDA/IP ]

Toshiba seeks to lower fab operating costs (2008-10-28) [ Manufacturing/Packaging ]
Report: OLED lighting to achieve higher growth (2008-10-28) [ Optoelectronics/Displays ]
China Sunergy, HHT ink silicon ingot supply pact (2008-10-28) [ Manufacturing/Packaging ]
Deconstructing the Nokia multisourcing chipset strategy (2008-10-28) [ RF/Microwave ]
Sony Shock D茅j脿 vu? (2008-10-27) [ Manufacturing/Packaging ]

Nokia's dream: Innovation beyond handsets (2008-10-27) [ RF/Microwave ]
Toshiba readies 40nm node, but is Sony? (2008-10-27) [ Manufacturing/Packaging ]
IC equipment markets close to 'bad cycle' of '01 (2008-10-27) [ EDA/IP ]
REC taps M+W Zander to construct solar site in Singapore (2008-10-27) [ Manufacturing/Packaging ]
TI steps up support for Open Handset Alliance (2008-10-27) [ RF/Microwave ]

SMIC comes up with 0.11µm CIS process tech (2008-10-27) [ Manufacturing/Packaging ]
AMEC gains $58M in Series C funding (2008-10-27) [ Manufacturing/Packaging ]
Economic crunch forces design service firm to close shop (2008-10-27) [ EDA/IP ]
Compact car IC enhances capacity of vehicle systems (2008-10-27) [ Controls/MCUs ]
CMOS image sensor alerts drivers of road risks (2008-10-27) [ Sensors/MEMS ]

Compiler gets approval as standard port for GCC tools (2008-10-27) [ Embedded ]
National Semiconductor beefs up analog portfolio (2008-10-27) [ Embedded ]
Validation software boosts 10GBASE-T Ethernet testing (2008-10-27) [ T&M ]
'Green Fan' carries thermal speed control (2008-10-27) [ Embedded ]
Crosspoint switch works with USB 2.0 (2008-10-27) [ Interface ]

White LED driver suits up for automotive displays (2008-10-27) [ Optoelectronics/Displays ]
FAQs: TrustZone (2008-10-24) [ EDA/IP ]
HB LED driver enables green lighting for automotive apps (2008-10-24) [ Optoelectronics/Displays ]
CAN transceiver targets in-vehicle networking apps (2008-10-24) [ Networks ]
Class-D amp slashes up to 50% cost in car audio systems (2008-10-24) [ Amplifiers/Converters ]

Simulation tool upgrades multicore architectures (2008-10-24) [ EDA/IP ]
RTL power analysis enhances process geometries (2008-10-24) [ T&M ]
Two firms tie up to integrate GPS in hybrid cars (2008-10-24) [ Embedded ]
Power MOSFETs tout industry-leading features (2008-10-24) [ Power/Alternative Energy ]
Cellphone chip tunes into music over FM link (2008-10-24) [ RF/Microwave ]

Market maturity to slow down flat panel shipment growth (2008-10-24) [ Optoelectronics/Displays ]
Wi-Fi Alliance authorizes new testing lab in China (2008-10-24) [ T&M ]
GE invests $2.5M in solar company (2008-10-24) [ Power/Alternative Energy ]
Will everyone benefit from Symbian tool's success? (2008-10-24) [ EDA/IP ]
Analysis: NXP strives to survive lashes of economic downfall (2008-10-24) [ Manufacturing/Packaging ]

Samsung retreats from buying SanDisk (2008-10-24) [ Manufacturing/Packaging ]
Intel Capital infuses fresh funds into Silicon Hive (2008-10-24) [ Processors/DSPs ]
450mm wafer standard gets industry nod (2008-10-24) [ EDA/IP ]
A Smarter 802.11 Draft-N (2008-10-23) [ RF/Microwave ]
Feature-packed BLDC motor ICs trim overall system cost (2008-10-23) [ Controls/MCUs ]

Audio processors target in-car sound systems (2008-10-23) [ Processors/DSPs ]
MOSFETs promise low on-state resistance for industrial apps (2008-10-23) [ Power/Alternative Energy ]
Protection IC offers cell balancing for 10-cell battery packs (2008-10-23) [ Power/Alternative Energy ]
ADCs guarantee high performance at low power (2008-10-23) [ Amplifiers/Converters ]
MEMS microphones deliver clear sound recording (2008-10-23) [ Sensors/MEMS ]

Data converter chips upgrade high-density devices (2008-10-23) [ RF/Microwave ]
Programming tools ease parallel data constructs (2008-10-23) [ EDA/IP ]
IMEC favors EUV litho for 22nm node (2008-10-23) [ EDA/IP ]
Who would not think it's Intel? (2008-10-23) [ Manufacturing/Packaging ]
Android now ready as open-source software (2008-10-23) [ EDA/IP ]

What's in store for next-gen STBs? (2008-10-23) [ Amplifiers/Converters ]
ST, Navteq fuse tech to improve driver assistance apps (2008-10-23) [ RF/Microwave ]
Clear Skies Solar bags $8M project in India (2008-10-23) [ Manufacturing/Packaging ]
'Smart' car key prototype introduced (2008-10-23) [ RF/Microwave ]
SanDisk JV sale elicits questions, possibilities (2008-10-23) [ Manufacturing/Packaging ]

Putting Big Brother on auto-pilot (2008-10-22) [ Processors/DSPs ]
Low-power UHF RFID readers trim BOM (2008-10-22) [ RF/Microwave ]
Battery charger detects external power connections in mobile apps (2008-10-22) [ Power/Alternative Energy ]
Audio power amp targets automotive warning systems (2008-10-22) [ Amplifiers/Converters ]
Multimedia processors enable low-cost car infotainment (2008-10-22) [ Processors/DSPs ]

LEDs deliver improved backlight in large-screen LCDs (2008-10-22) [ Optoelectronics/Displays ]
High-capacity SSDs reduce enterprise costs (2008-10-22) [ Memory/Storage ]
High-current connector enhances overload capacity (2008-10-22) [ Networks ]
3D PoP stacks roll as next killer tech for handsets (2008-10-22) [ RF/Microwave ]
IT vendors walk 'green' route (2008-10-22) [ Manufacturing/Packaging ]

SunPower, Naturener establish 7MW solar plant in Spain (2008-10-22) [ Power/Alternative Energy ]
Ericsson to deliver HSPA mobile data solutions to Intel MIDs (2008-10-22) [ RF/Microwave ]
Hitachi to supply motors, Li-ion batteries to Eaton (2008-10-22) [ Power/Alternative Energy ]
Nokia details plans to take Symbian to 'next level' (2008-10-22) [ RF/Microwave ]
TI seeks to dispose portion of mobile baseband unit (2008-10-22) [ Manufacturing/Packaging ]

SanDisk agrees to sell 30% of JV share amid losses (2008-10-22) [ Manufacturing/Packaging ]
Comment: Planning to get a wireless network device? (2008-10-22) [ RF/Microwave ]
First digital audio amps set to invade car radios (2008-10-21) [ Amplifiers/Converters ]
Lighting management IC enhances viewing quality in portables (2008-10-21) [ Optoelectronics/Displays ]
Clock multiplier with 5ps jitter targets consumer apps (2008-10-21) [ Amplifiers/Converters ]

Seiko Epson readies 3D images for handsets (2008-10-21) [ Optoelectronics/Displays ]
High-capacity ADCs minimize system operation cost (2008-10-21) [ Amplifiers/Converters ]
Affordable silicon ink speeds up RFID tagging (2008-10-21) [ RF/Microwave ]
Multiplexers eradicate need for external protection (2008-10-21) [ Interface ]
Digital temperature sensor zooms in on accuracy (2008-10-21) [ Sensors/MEMS ]

Qualcomm inks 3G license deal with China's Wingtech (2008-10-21) [ RF/Microwave ]
Sanyo ups solar module production capacity in Mexico (2008-10-21) [ Manufacturing/Packaging ]
Maxim buys H.264 video compression specialist (2008-10-21) [ Amplifiers/Converters ]
AMD trims down losses in Q3 (2008-10-21) [ Manufacturing/Packaging ]
Analysis: Two giants brace for dim Q4, unpredictable '09 (2008-10-21) [ EDA/IP ]

Toshiba seeks to buy SanDisk JV (2008-10-21) [ Manufacturing/Packaging ]
Microsemi makes Babcock purchase (2008-10-21) [ Manufacturing/Packaging ]
CTO junks calls to spin off Cadence (2008-10-21) [ EDA/IP ]

--- Total 153 records ---

Article review

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