2008-02-01-10 Article review - EE Times-Asia

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Jun 23,2016

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Article review (Sorted By Date)

ABI: DTV receiver market up for 32% growth by 2013 (2008-02-08) [ RF/Microwave ]
Silicon Hive, Apical co-develop embedded imaging sol'n for mobiles (2008-02-08) [ Optoelectronics/Displays ]
Atmel enters touch sensing market with Quantum acquisition (2008-02-08) [ Interface ]
Apple beefs up iPhone, iPod Touch storage capacity (2008-02-08) [ Memory/Storage ]
Freescale to pay $110M for SigmaTel (2008-02-08) [ Embedded ]

TI, MIT develop design technique for ultralow-voltage ICs (2008-02-08) [ Power/Alternative Energy ]
ARM, Samsung extend licensing deal (2008-02-08) [ EDA/IP ]
Wi-Fi, WiMAX soon to invade handsets (2008-02-08) [ RF/Microwave ]
Next-gen memory race heats up as bets roll (2008-02-08) [ Memory/Storage ]
Report: Toshiba to allocate $6.6B for new NAND plant (2008-02-08) [ Manufacturing/Packaging ]

GPS turns cellphone into handy navigation device (2008-02-08) [ RF/Microwave ]
Processor designers debate future of multicore (2008-02-08) [ EDA/IP ]
65nm DTV receivers cut power draw, design footprint (2008-02-08) [ RF/Microwave ]
RF transmit processor combines DUC, CFR, DPD (2008-02-08) [ RF/Microwave ]
Scope breaks 1Gpt memory barrier (2008-02-08) [ T&M ]

Reconfigurable analog baseband LSI tailored for SDR (2008-02-08) [ RF/Microwave ]
Variable gain amp sets new performance standard (2008-02-08) [ Amplifiers/Converters ]
Programmable LCD modules fast track development cycles (2008-02-08) [ Optoelectronics/Displays ]
Mezzanine connectors tout high density, high speed (2008-02-08) [ Networks ]
SFP+ interconnects deliver up to 10Gbit/s (2008-02-08) [ Networks ]

Active copper cables operate at 10Gbit/s over 10m (2008-02-08) [ Networks ]
PoE midspan promises up to 576W with 8/16 ports (2008-02-08) [ Networks ]
Tiny step-down DC/DC regulates power from various sources (2008-02-08) [ Power/Alternative Energy ]
Tiny 40A automotive relay switches heavy loads (2008-02-08) [ Networks ]
Cordless phone enters next phase (2008-02-07) [ RF/Microwave ]

TI bares details of 45nm process (2008-02-07) [ Manufacturing/Packaging ]
IBM expands India foothold with new delivery center (2008-02-07) [ Manufacturing/Packaging ]
Ericsson equips Lenovo notebooks with built-in HSPA (2008-02-07) [ RF/Microwave ]
Taiwan flat-panel market to hit $62.11B by 2011 (2008-02-07) [ Manufacturing/Packaging ]
ZTE boosts Hutchison's 3G mobile broadband offerings (2008-02-07) [ RF/Microwave ]

NXP, ARM expand MCU tech licensing deal (2008-02-07) [ Embedded ]
QLogic picks AMCC's storage processor (2008-02-07) [ Memory/Storage ]
Huawei, Symantec finalize storage, security JV (2008-02-07) [ Memory/Storage ]
Surface PC for consumers in the works from Microsoft (2008-02-07) [ Embedded ]
Dwindling VC funding 'troubling' for semis (2008-02-07) [ Manufacturing/Packaging ]

Chips of the future will mimic human learning (2008-02-07) [ Amplifiers/Converters ]
Samsung: UD tech, 3D content make future TV (2008-02-07) [ Optoelectronics/Displays ]
Tektronix adds live RF to mid-range analyzers (2008-02-07) [ T&M ]
AC/DC telco rectifier delivers 96% efficiency (2008-02-07) [ RF/Microwave ]
GaAs MMIC packaging uses surface-mount tech (2008-02-07) [ RF/Microwave ]

Aruba intros 'blast-resistant' Wi-Fi gear (2008-02-07) [ RF/Microwave ]
Startup adds wireless monitor to band-aids (2008-02-07) [ RF/Microwave ]
SATA-compatible NAND flash controller supports 150MBps (2008-02-07) [ Memory/Storage ]
Media player chip brings HD sound to music phones (2008-02-07) [ RF/Microwave ]
Module measures high-speed serial bus signals (2008-02-07) [ T&M ]

DSP with MAC, PHY functions goes 'Beyond 3G' (2008-02-07) [ FPGAs/PLDs ]
Fujitsu debuts 77GHz CMOS-based power amp (2008-02-07) [ Amplifiers/Converters ]
Differential connector system eyes high-speed designs (2008-02-07) [ Networks ]
Panel pot with cermet offers 6W power rating at 50°C (2008-02-07) [ Amplifiers/Converters ]
Google exec: Microsoft's Yahoo bid 'troubling' (2008-02-06) [ Embedded ]

AMD to set up sales, R&D center in Chengdu (2008-02-06) [ Manufacturing/Packaging ]
Fairchild opens R&D center in India (2008-02-06) [ EDA/IP ]
Intel, Micron co-develop 'fastest' NAND flash tech (2008-02-06) [ Manufacturing/Packaging ]
Nvidia acquires gaming physics tech provider (2008-02-06) [ Optoelectronics/Displays ]
Will EUV litho ever cross over from R&D to production? (2008-02-06) [ Manufacturing/Packaging ]

NEC to work on PMICs for mobile Internet devices (2008-02-06) [ Power/Alternative Energy ]
Qualcomm, Huawei ink Node B tech transfer deal (2008-02-06) [ RF/Microwave ]
Flextronics fights to remain in EMS race (2008-02-06) [ Manufacturing/Packaging ]
Cisco helps India beef up network engineering workforce (2008-02-06) [ Networks ]
Elpida, Hynix beat 2007 DRAM market downtrend (2008-02-06) [ Manufacturing/Packaging ]

Samsung leads 2008 $1B capex club (2008-02-06) [ Manufacturing/Packaging ]
RF modules target handsets in emerging markets (2008-02-06) [ RF/Microwave ]
Complete LTE base station ref design debuts (2008-02-06) [ RF/Microwave ]
Bloombase boosts data security in Hifn data cards (2008-02-06) [ Embedded ]
Power-supply supervisor does reverse sequencing (2008-02-06) [ Power/Alternative Energy ]

SAS RAID controllers fit midrange servers (2008-02-06) [ Embedded ]
'First' 1.4&#181m; 5Mpixel image sensor rolls for handsets (2008-02-06) [ Sensors/MEMS ]
ComboMemory devices eye entry-level handsets (2008-02-06) [ Memory/Storage ]
Analog IC integrates adjustable resistor tech (2008-02-06) [ Power/Alternative Energy ]
Backplane connector operates at 12.5Gbit/s (2008-02-06) [ Networks ]

Car LCD controller LSI rolls with video decoder (2008-02-06) [ Controls/MCUs ]
Memory compiler optimized for UMC 65nm LL process (2008-02-06) [ EDA/IP ]
NXP's GloNav acquisition yields 'smallest' GPS solution (2008-02-06) [ RF/Microwave ]
Huawei, Mobily to deploy HSDPA in Saudi Arabia (2008-02-05) [ Networks ]
IBM sets up first cloud computing center in China (2008-02-05) [ Manufacturing/Packaging ]

Survey confirms LED lighting market growth (2008-02-05) [ Manufacturing/Packaging ]
SIA: Chip sales hit new record with $255.6B in 2007 (2008-02-05) [ Optoelectronics/Displays ]
Applied beefs up solar cell biz with Baccini buyout (2008-02-05) [ Manufacturing/Packaging ]
Analysis: Mobile biz spinoff could spell the end for Motorola (2008-02-05) [ Manufacturing/Packaging ]
HP dethrones TI as MEMS king in 2007 (2008-02-05) [ Sensors/MEMS ]

Intel readies $1B investment in India (2008-02-05) [ Controls/MCUs ]
Nokia Siemens, Ubiquisys enable 3G at home with femtocells (2008-02-05) [ RF/Microwave ]
Maxim to fold Dallas fab, exit RF biz (2008-02-05) [ Manufacturing/Packaging ]
Microsoft CEO on $44.6B Yahoo acquisition bid (2008-02-05) [ Embedded ]
Linear Tech debuts SiP signal chain receiver modules (2008-02-05) [ RF/Microwave ]

Sub-$100 Linux phone offers 3G functionalities (2008-02-05) [ RF/Microwave ]
Dual-core chips achieve 1,920 MIPS processing (2008-02-05) [ Controls/MCUs ]
All-metal rotary encoders fit rugged apps (2008-02-05) [ Sensors/MEMS ]
Multisensor interface IC uses 30µW of power (2008-02-05) [ Interface ]
Memory controller SSD modules integrate NAND flash (2008-02-05) [ Memory/Storage ]

Software solution ensures REACH compliance (2008-02-05) [ Manufacturing/Packaging ]
Battery fuel gauge with LDO rolls for mobile apps (2008-02-05) [ Power/Alternative Energy ]
Samsung intros 128Gbyte MLC flash-based SSDs (2008-02-05) [ Memory/Storage ]
Power filters handle up to 20A (2008-02-05) [ Power/Alternative Energy ]
Parametric probe cards cut testing costs at 45nm, beyond (2008-02-05) [ T&M ]

Kits speed up DSP-based motor control design (2008-02-05) [ EDA/IP ]
Power-supply optocoupler basics (2008-02-05) [ Power/Alternative Energy ]
Study: Governments fail to tap full potential of ICT (2008-02-04) [ RF/Microwave ]
Matsushita, Samsung settle all patent suits (2008-02-04) [ Optoelectronics/Displays ]
Mitsubishi to acquire Renesas' Kumamoto facility (2008-02-04) [ Manufacturing/Packaging ]

Airwaves auction marks new record with $15.6B (2008-02-04) [ RF/Microwave ]
Motorola mulls separating mobile unit (2008-02-04) [ Manufacturing/Packaging ]
China confers TD-SCDMA access licenses (2008-02-04) [ RF/Microwave ]
Qualcomm, Mio to co-develop connected PNDs (2008-02-04) [ RF/Microwave ]
Femto Forum gets NXP onboard (2008-02-04) [ RF/Microwave ]

Sun stirs industry support for Rock CPU (2008-02-04) [ Embedded ]
Flextronics shakes off doubts over Solectron acquisition (2008-02-04) [ Manufacturing/Packaging ]
IBM seeks standard to link chip models with tools (2008-02-04) [ EDA/IP ]
Intel schedules phase out of 65nm processors (2008-02-04) [ Processors/DSPs ]
Rise time accelerator suits 400kHZ operation (2008-02-04) [ Amplifiers/Converters ]

AMD teraflop GPU pushes game realism beyond HD (2008-02-04) [ Embedded ]
'First' programmable multimode LTE modem rolls (2008-02-04) [ RF/Microwave ]
Data converter toolkit speeds up design time (2008-02-04) [ Embedded ]
Video amp with load detect saves up to 75% power (2008-02-04) [ Amplifiers/Converters ]
Enhanced signal generators deal with CDMA 1xEVDO (2008-02-04) [ T&M ]

Contact interface promises high density, speed (2008-02-04) [ Interface ]
VoIP echo canceller handles up to 512ms round-trip delays (2008-02-04) [ RF/Microwave ]
Resistors offer resistance values up to 10GΩ (2008-02-04) [ Power/Alternative Energy ]
IR receivers resist noise, disturbance signals (2008-02-04) [ RF/Microwave ]
Audio DAC extends mobile music playback time (2008-02-04) [ Amplifiers/Converters ]

High-speed connector platform comes in stacking version (2008-02-04) [ Networks ]
ESD architecture simplifies design, cuts cost (2008-02-01) [ Embedded ]
Parametric probe cards reduce cost of tests at 45nm (2008-02-01) [ Manufacturing/Packaging ]
Voltage supervisors promise up to 4.65V threshold (2008-02-01) [ Power/Alternative Energy ]
SoC ready for simultaneous still, video shots (2008-02-01) [ Controls/MCUs ]

Freescale fortifies S08 MCU family (2008-02-01) [ Controls/MCUs ]
Power management IC tipped for Intel's Montevina platform (2008-02-01) [ Power/Alternative Energy ]
ARM-based MCU suits USB-enabled embedded control apps (2008-02-01) [ Interface ]
High-speed SRAMs roll into production (2008-02-01) [ Memory/Storage ]
Industrial keyboard features new function keys (2008-02-01) [ Interface ]

WLED driver enables large LCDs in portable apps (2008-02-01) [ Optoelectronics/Displays ]
Multimedia codec integrates power management (2008-02-01) [ Amplifiers/Converters ]
Car MCUs tailored for new emission standards (2008-02-01) [ Embedded ]
Select the right network connection for your MCU-based M2M app (2008-02-01) [ Interface ]
Awaiting the bountiful organic chip harvest (2008-02-01) [ Manufacturing/Packaging ]

Saving Moore's Law and reinventing transistors (2008-02-01) [ Manufacturing/Packaging ]
Development kits are easier to use now (2008-02-01) [ Embedded ]
Steer the wheels with microcontrollers (2008-02-01) [ Embedded ]
Sensor improvements usher cars to safety (2008-02-01) [ Sensors/MEMS ]
External adapter unites TiVo, Cable TV (2008-02-01) [ Interface ]

ARC pushes mobile multimedia SoC design (2008-02-01) [ RF/Microwave ]
Enabling e-paper displays (2008-02-01) [ Optoelectronics/Displays ]
Integration key to 802.11n success (2008-02-01) [ RF/Microwave ]
Clean tech to get more VC funding (2008-02-01) [ Manufacturing/Packaging ]
It's a full house for digital TV links (2008-02-01) [ RF/Microwave ]

Maximize mobile WiMAX opportunities (2008-02-01) [ RF/Microwave ]

--- Total 146 records ---

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