2008-04-21-01 Article review

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Article review (Sorted By Date)

Use MSGQ module to optimize sRIO gains (2008-05-01) [ Processors/DSPs ]
Defining the memory's role in a secured environment (2008-05-01) [ Memory/Storage ]
5GHz PCIe 2.0 core aims to speed up Express road map (2008-05-01) [ EDA/IP ]
Touch sensors target transparent user interfaces (2008-05-01) [ Sensors/MEMS ]
TI unveils hot swap controllers for AdvancedMCs (2008-05-01) [ RF/Microwave ]

Memory compilers, logic libraries support TSMC 40nm process (2008-05-01) [ Embedded ]
Vocoder IC rolls with full duplex capability (2008-05-01) [ Amplifiers/Converters ]
Broadcom debuts 65nm 10GbE PHY transceiver (2008-05-01) [ RF/Microwave ]
The MathWorks pitches automated model-checking support (2008-05-01) [ EDA/IP ]
Freescale extends 8bit MCU offering for industrial, automotive (2008-05-01) [ Controls/MCUs ]

Processing engine works with FPGA mezzanine card standard (2008-05-01) [ Interface ]
Industrial LCD module achieves superior viewing angles (2008-05-01) [ Optoelectronics/Displays ]
Automotive memory products withstand extreme heat (2008-05-01) [ Memory/Storage ]
Circular connector comes in rugged metal shell (2008-05-01) [ Networks ]
Second Galileo satellite now in orbit (2008-05-01) [ RF/Microwave ]

Survey: Free-to-air mobile TV is next killer app (2008-05-01) [ RF/Microwave ]
Vietnam venture group invests in IC services firm (2008-05-01) [ Manufacturing/Packaging ]
Samsung details $27.9B investment plans (2008-05-01) [ Manufacturing/Packaging ]
Much deserved accolade for ADI co-founder (2008-05-01) [ Processors/DSPs ]
The language of multiprocessing (2008-05-01) [ Embedded ]

Apprenticeship hones practical engineering skills (2008-05-01) [ EDA/IP ]
Consider real-world conditions in WiMAX MIMO test (2008-05-01) [ T&M ]
Use analog switches for multimedia cellphone design (2008-05-01) [ RF/Microwave ]
Partition and package to miniaturize handsets (2008-05-01) [ RF/Microwave ]
HDMI goes mobile (2008-05-01) [ Processors/DSPs ]

MLC adds muscle to NAND (2008-05-01) [ Memory/Storage ]
Understanding embedded antennas (2008-05-01) [ RF/Microwave ]
Eliminate bugs with static analysis (2008-05-01) [ T&M ]
Fabless ASIC camp gets funds (2008-05-01) [ EDA/IP ]
Chip rush promise from IP-enabled CE? (2008-05-01) [ RF/Microwave ]

SoCs wrestle with schedule delays (2008-05-01) [ EDA/IP ]
Freescale teams with China's Chery on car electronics (2008-04-30) [ Manufacturing/Packaging ]
ARM, Mindspeed enable next-gen broadband service (2008-04-30) [ Networks ]
Infineon beefs up power biz with Primarion acquisition (2008-04-30) [ Power/Alternative Energy ]
Singapore inventor gets patent for flip-chip IC assembly tech (2008-04-30) [ Manufacturing/Packaging ]

TSMC IC design collaboration strategy stirs controversy (2008-04-30) [ EDA/IP ]
Spansion enters memory cross-licensing deal with IBM (2008-04-30) [ Memory/Storage ]
Oerlikon opens solar production line in China (2008-04-30) [ Manufacturing/Packaging ]
Report: Software gap threatens NFC takeoff (2008-04-30) [ RF/Microwave ]
Cray, Intel ink supercomputer deal (2008-04-30) [ Embedded ]

CSR taps Virage Logic's IP for next-gen Bluetooth devices (2008-04-30) [ EDA/IP ]
ASMI moves to save front-end equipment biz (2008-04-30) [ Manufacturing/Packaging ]
U.S. FCC explains low bidder turnout for 700MHz D block (2008-04-30) [ RF/Microwave ]
Automated tester validates designs with AMCC PowerPC chips (2008-04-30) [ T&M ]
Delta-sigma ADCs come in ultratiny packages (2008-04-30) [ Amplifiers/Converters ]

SMC GbE switches support IBM 'green' servers (2008-04-30) [ Networks ]
MMIC switch addresses multiband antenna tuning (2008-04-30) [ RF/Microwave ]
SoC integrates 12 ICs for smaller, cheaper PNDs (2008-04-30) [ RF/Microwave ]
Display controller supports VGA in mobile LCDs (2008-04-30) [ Optoelectronics/Displays ]
Xilinx offers triple-rate SDI reference designs (2008-04-30) [ FPGAs/PLDs ]

Off-the-shelf DC/DC converter modules fit for space use (2008-04-30) [ Power/Alternative Energy ]
Leadis infuses proprietary tech in new driver IC (2008-04-30) [ Optoelectronics/Displays ]
Pancake-thin fan cools at 174cfm (2008-04-30) [ Amplifiers/Converters ]
Agilent upgrades RFIC simulation software (2008-04-30) [ EDA/IP ]
Rectifiers tout fast, soft reverse recovery times (2008-04-30) [ Power/Alternative Energy ]

Emerging markets boost global SIM card sales (2008-04-29) [ Memory/Storage ]
Samsung-Sony JV to build 8G TFT-LCD line (2008-04-29) [ Manufacturing/Packaging ]
Hostile takeover looms as Yahoo ignores Microsoft's ultimatum (2008-04-29) [ Networks ]
China Mobile, Softbank, Vodafone set up mobile Internet lab (2008-04-29) [ RF/Microwave ]
Oracle, ZTE tie-up develops SDP platform for global market (2008-04-29) [ RF/Microwave ]

Trina Solar inks supply agreement with Silfab (2008-04-29) [ Manufacturing/Packaging ]
Apple ventures into the IC world (2008-04-29) [ Manufacturing/Packaging ]
TSMC throws hat in 32nm high-k ring (2008-04-29) [ Manufacturing/Packaging ]
Market researchers report on Q1 08 cellphone shipments (2008-04-29) [ RF/Microwave ]
JVC set to bring LCD TV production to Thailand (2008-04-29) [ Manufacturing/Packaging ]

Analysis: Infineon can't quite shake off Qimonda (2008-04-29) [ Manufacturing/Packaging ]
iSuppli: Worst may be over for DRAM suppliers (2008-04-29) [ Manufacturing/Packaging ]
PLMD chips aim at high-voltage telephony apps (2008-04-29) [ Networks ]
High-density connector delivers high signal density (2008-04-29) [ Networks ]
Cat 6 RJ45 connector now in shielded version (2008-04-29) [ Networks ]

Tools aid design of Stellaris MCUs with USB (2008-04-29) [ Embedded ]
Aluminum electrolytic capacitors tout wide performance range (2008-04-29) [ Power/Alternative Energy ]
Class D amps claim 'lowest' solution cost (2008-04-29) [ Amplifiers/Converters ]
New BlueCore5 platform allows hands-free control (2008-04-29) [ Processors/DSPs ]
LabVIEW SignalExpress 2.5 supports Tektronix scopes (2008-04-29) [ T&M ]

Leadis debuts standalone Class-G headphone amps (2008-04-29) [ Amplifiers/Converters ]
Shunt-type reference voltage IC suits data converter, industrial apps (2008-04-29) [ Power/Alternative Energy ]
Software optimizes Renesas' SH-Mobile processor (2008-04-29) [ Embedded ]
DDR memory controller ups efficiency by 20% (2008-04-29) [ Memory/Storage ]
Reduce power consumption in UWB chips (2008-04-28) [ RF/Microwave ]

Pioneer, Matsushita merge plasma display biz (2008-04-28) [ Manufacturing/Packaging ]
Infineon, PGP partner on data security solutions (2008-04-28) [ Embedded ]
OLPC loses another executive (2008-04-28) [ Embedded ]
China outnumbers U.S. Internet population (2008-04-28) [ Networks ]
Is Microsoft reconsidering decision to ax XP? (2008-04-28) [ Embedded ]

Neonode IR touchscreen technology gets Japan patent (2008-04-28) [ Optoelectronics/Displays ]
Samsung brings 3D experience to plasma HDTV (2008-04-28) [ Optoelectronics/Displays ]
SMIC-ASTRI team yields dual-mode UWB MAC ASIC (2008-04-28) [ Manufacturing/Packaging ]
Elpida, Qimonda forge DRAM tech partnership (2008-04-28) [ Manufacturing/Packaging ]
Apple's PA Semi buyout may hit roadblock (2008-04-28) [ Embedded ]

Tax exemption expiry worries Indian IT firms (2008-04-28) [ EDA/IP ]
Macronix, Qimonda scrap flash development deal (2008-04-28) [ Manufacturing/Packaging ]
Analysis: It's the season of memory JVs (2008-04-28) [ Memory/Storage ]
Marvell tips low-power SoCs (2008-04-28) [ Embedded ]
Slim FPC connector has backlock mechanism (2008-04-28) [ Embedded ]

First HSPA+ test tool for 3GPP devices debuts (2008-04-28) [ T&M ]
2.7-inch LCD module boasts high pixel density (2008-04-28) [ Optoelectronics/Displays ]
Three-channel step-down DC/DC converter touts LDO controller (2008-04-28) [ Power/Alternative Energy ]
Op amps promise ultralow noise (2008-04-28) [ Amplifiers/Converters ]
Aeroflex announces test suit for C.S0044-A spec (2008-04-28) [ T&M ]

Power amp suits 3G handsets for W-CDMA network (2008-04-28) [ Amplifiers/Converters ]
Programmable LCD devices offer 64 backlight colors (2008-04-28) [ Optoelectronics/Displays ]
AC/DC power adapter promises 84% efficiency (2008-04-28) [ Amplifiers/Converters ]
1W DC/DC converters housed in tiny package (2008-04-28) [ Amplifiers/Converters ]
AMD revs up portfolio with new Phenom triple-core processors (2008-04-28) [ Processors/DSPs ]

HFF crystal oscillators come in compact sizes (2008-04-28) [ RF/Microwave ]
Devices accelerate Wi-Fi network deployment (2008-04-25) [ Networks ]
16bit dual-channel DAC aims at 3G/4G comms (2008-04-25) [ Amplifiers/Converters ]
Enhanced Cortex-M3 achieves ultralow power (2008-04-25) [ Embedded ]
Smart power modules drive two-phase SRM (2008-04-25) [ Power/Alternative Energy ]

Portable scopes roll for embedded designs (2008-04-25) [ T&M ]
Spice tool addresses chip design bottleneck (2008-04-25) [ EDA/IP ]
Rotary magnetic encoders operate in harsh environments (2008-04-25) [ Sensors/MEMS ]
Energy meters handle next-gen monitoring apps (2008-04-25) [ Power/Alternative Energy ]
10GbE blasts ahead with new switch, transceiver, card offerings (2008-04-25) [ Networks ]

PXI embedded controllers promise 'exceptional' performance (2008-04-25) [ T&M ]
CAN transceiver features advanced power management (2008-04-25) [ Networks ]
Huawei inks GSM/UMTS deal with O2 Germany (2008-04-25) [ Networks ]
Galileo project all set for takeoff (2008-04-25) [ RF/Microwave ]
RIM sets up BlackBerry R&D center in Germany (2008-04-25) [ Manufacturing/Packaging ]

Rambus, Spansion collaborate on next-gen flash (2008-04-25) [ Memory/Storage ]
Infineon acknowledges talks on Qimonda sale (2008-04-25) [ Manufacturing/Packaging ]
Apple debuts in IC market with PA Semi buyout (2008-04-25) [ Manufacturing/Packaging ]
Intel slashes 65nm prices for 45nm switch (2008-04-25) [ Embedded ]
Microsoft: PC bows out as Web era dawns (2008-04-25) [ Embedded ]

South Korea plans tech park for Japanese companies (2008-04-25) [ Manufacturing/Packaging ]
Parade Technologies bets on DisplayPort for PC video (2008-04-25) [ Interface ]
Novellus exec sees the silver lining (2008-04-25) [ Manufacturing/Packaging ]
Asimo robot now a symphony conductor (2008-04-25) [ Embedded ]
Low-cost Bluetooth solution targets PNDs, in-car systems (2008-04-24) [ RF/Microwave ]

Infineon adds RoHs-complaint chips to NovalithIC line (2008-04-24) [ Power/Alternative Energy ]
Chip streamlines power supply designs (2008-04-24) [ Power/Alternative Energy ]
First LF antenna driver rolls for PEG, PG systems (2008-04-24) [ RF/Microwave ]
Platform designs smart user interfaces for Atmel MCUs (2008-04-24) [ EDA/IP ]
LED drivers enhance LCD backlight control, battery life (2008-04-24) [ Optoelectronics/Displays ]

Point-of-load DC/DC converter takes up little space (2008-04-24) [ Amplifiers/Converters ]
Programmable chips deliver flexibility, differentiation (2008-04-24) [ FPGAs/PLDs ]
MPUs integrate flexible interface modules (2008-04-24) [ Interface ]
Impinj debuts 'few-time' non-volatile memory IP (2008-04-24) [ Memory/Storage ]
Microchip updates 32bit USB-OTG MCU portfolio (2008-04-24) [ Embedded ]

WLED driver packs negative charge pump, two LDOs (2008-04-24) [ Optoelectronics/Displays ]
Hitachi GST launches channel partner program in India (2008-04-24) [ Memory/Storage ]
Sony buys digital media firm for $260M (2008-04-24) [ Embedded ]
Nokia, Sony BMG weave music partnership (2008-04-24) [ RF/Microwave ]
Samsung chair steps down amidst controversy (2008-04-24) [ Manufacturing/Packaging ]

Shenzhen Airlines to offer in-flight GSM phone service (2008-04-24) [ RF/Microwave ]
Microfluidic lab-on-chip technology steps forward (2008-04-24) [ EDA/IP ]
Seoul Semi, Everlight settle patent suit with Columbia U prof (2008-04-24) [ Optoelectronics/Displays ]
Report: India design market hit $6B in 2007 (2008-04-24) [ EDA/IP ]
TI stands by analog to stay on top (2008-04-24) [ Manufacturing/Packaging ]

Court throws out FTC's orders in Rambus suit (2008-04-24) [ Memory/Storage ]
TSMC CEO sees steady growth in semi market (2008-04-24) [ Manufacturing/Packaging ]
Winbond, Qimonda team up on next-gen DRAM (2008-04-24) [ Manufacturing/Packaging ]
DRAMs get beefed up (2008-04-24) [ Memory/Storage ]
Taiwan LED makers shine in the market (2008-04-23) [ Optoelectronics/Displays ]

Microsoft-Novell partnership reaches China (2008-04-23) [ Embedded ]
SigmaTel stockholders approve Freescale takeover (2008-04-23) [ Manufacturing/Packaging ]
Intel earmarks $500M for WiMAX deployment in Taiwan (2008-04-23) [ RF/Microwave ]
Motorola invests in virtualization software firm (2008-04-23) [ Embedded ]
Google joins investors pooling funds for solar startup (2008-04-23) [ Power/Alternative Energy ]

SIA launches fight against fake chips (2008-04-23) [ Manufacturing/Packaging ]
Renesas, IMEC collaborate on reconfigurable transceivers (2008-04-23) [ RF/Microwave ]
Details of Siemens scandal becoming clear (2008-04-23) [ RF/Microwave ]
Infineon intensifies Qimonda clean up (2008-04-23) [ Memory/Storage ]
Micron, Nanya form DRAM joint venture (2008-04-23) [ Manufacturing/Packaging ]

Analysis: AMD's cryptic asset-smart strategy (2008-04-23) [ Manufacturing/Packaging ]
150Mbit/s fiber optic transceiver supports MOST Rev 3.0 (2008-04-23) [ Optoelectronics/Displays ]
IAR, Atmel delivers tool support for AVR XMEGA (2008-04-23) [ Embedded ]
TI announces full production release of DDR3 register (2008-04-23) [ Memory/Storage ]
Seiko touts 'thinnest' chip-type double-layer capacitor (2008-04-23) [ Sensors/MEMS ]

2.5-inch, 320GB HDD features automatic hardware-based encryption (2008-04-23) [ Memory/Storage ]
PXI, PCI, VXI oscilloscopes roll from ZTEC (2008-04-23) [ T&M ]
ExpressCard interfaces designed for avionics testing (2008-04-23) [ T&M ]
Low-latency DDR2 SO-DIMM targets notebook market (2008-04-23) [ Memory/Storage ]
CEVA intros high-performance DSP platforms (2008-04-23) [ Processors/DSPs ]

Taiyo Yuden claims 'smallest' wirewound power inductors (2008-04-23) [ Power/Alternative Energy ]
Clock generator suits high-speed system equipment (2008-04-23) [ Interface ]
Step-down switching regulator has three adjustable outputs (2008-04-23) [ Power/Alternative Energy ]
Designing DSP-based digital DC/DC power supply (Part 1) (2008-04-23) [ Processors/DSPs ]
Steps to reduce non-stationary mobile phone noise up to 25dB (2008-04-22) [ RF/Microwave ]

Report: GPS sector to become $1B market in 2012 (2008-04-22) [ RF/Microwave ]
Court junks FormFactor's patent complaint (2008-04-22) [ T&M ]
Fujitsu, Indiana U partner on optical network research (2008-04-22) [ Optoelectronics/Displays ]
Alcatel-Lucent inks R&D MOU with South Korea (2008-04-22) [ RF/Microwave ]
TSMC likely to pay UniRAM additional $5M (2008-04-22) [ Manufacturing/Packaging ]

Dai Nippon, Brion, ST develop photomask verification for 45nm (2008-04-22) [ EDA/IP ]
Apple patent applications: iGlasses anyone? (2008-04-22) [ Optoelectronics/Displays ]
Symposium reveals future of chip design (2008-04-22) [ EDA/IP ]
IP experts agree rules need to be modified (2008-04-22) [ EDA/IP ]
NXP steps out of Philips' shadow (2008-04-22) [ Manufacturing/Packaging ]

AMD mulls next move (2008-04-22) [ Manufacturing/Packaging ]
Enterprise drive stores 450Gbyte of data (2008-04-22) [ Memory/Storage ]
Synopsys touts first certified USB 2.0 PHY IP for 45nm (2008-04-22) [ EDA/IP ]
Step-down converter steps up to power requirements (2008-04-22) [ Power/Alternative Energy ]
Buffers include two HDMI channels to HDTV sets (2008-04-22) [ Optoelectronics/Displays ]

Dual MOSFETs come in tiny SOT-963 package (2008-04-22) [ Power/Alternative Energy ]
IP camera ref design features H.264 compression (2008-04-22) [ EDA/IP ]
NI LabVIEW tailored for ARM MCUs (2008-04-22) [ Embedded ]
Wi-Fi gets a lift with SiGe's PA (2008-04-22) [ RF/Microwave ]
3.3V dual SCART is power-efficient (2008-04-22) [ Interface ]

VCSO has expanded frequency range, ultralow jitter (2008-04-22) [ Sensors/MEMS ]
16bit USB MCU adds OTG functionality (2008-04-22) [ Embedded ]
Programmable automation controller is smart (2008-04-22) [ Controls/MCUs ]
Windows Embedded sets sights on Asia (2008-04-21) [ Embedded ]
Worldwide semi equipment spending to drop 20% in '08 (2008-04-21) [ Manufacturing/Packaging ]

Teramobile laser triggers lightning strikes (2008-04-21) [ Optoelectronics/Displays ]
AuthenTec gains software assets of EzValidation (2008-04-21) [ Sensors/MEMS ]
Boeing, Tata to run aerodynamic simulations on Eka superPC (2008-04-21) [ T&M ]
Memory tech puts 300M tunes in MP3 players (2008-04-21) [ Memory/Storage ]
Chip brings e-paper display to interactive apps (2008-04-21) [ Optoelectronics/Displays ]

EU okays acquisition of Activision by Vivendi (2008-04-21) [ Embedded ]
Nokia opens research 'lablet' at Helsinki University (2008-04-21) [ RF/Microwave ]
IBM kiosk technology to serve China airport (2008-04-21) [ Interface ]
SoC complexity, cost compel companies to collaborate (2008-04-21) [ EDA/IP ]
Firms embark on airborne pathogen detector project (2008-04-21) [ T&M ]

16bit LED driver improves full-color image quality (2008-04-21) [ Optoelectronics/Displays ]
Buck regulator touts highest efficiency for DVS apps (2008-04-21) [ Power/Alternative Energy ]
Synplicity tips device-independent FPGA design tool (2008-04-21) [ FPGAs/PLDs ]
Production-ready processor core for FPGAs rolls (2008-04-21) [ FPGAs/PLDs ]
Camera processor IP core snaps high-res images for mobiles (2008-04-21) [ Controls/MCUs ]

Transistor assures peak power for UHF broadcasts (2008-04-21) [ RF/Microwave ]
Broadcom adds iSCSI HBA functionality to 10GbE controllers (2008-04-21) [ Networks ]
XtremeDSP ver10.1 improves DSP, ESL design (2008-04-21) [ Processors/DSPs ]
AMD 3D graphics card supports DisplayPort (2008-04-21) [ Processors/DSPs ]
Toshiba SpursEngine stream processors now sampling (2008-04-21) [ Processors/DSPs ]

FRAM chip records data sans MCU (2008-04-21) [ Manufacturing/Packaging ]
Ambient light photo sensor mimics human eye (2008-04-21) [ Sensors/MEMS ]

--- Total 227 records ---

Article review

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