2009-02-01-10 Article review - EE Times-Asia

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Article review (Sorted By Date)

The 5th commandment for effective standards (2009-02-10) [ EDA/IP ]
Campaigning for patent reform (2009-02-10) [ EDA/IP ]
Managing the recession (2009-02-10) [ Networks ]
Z-Foil resistors boast fast thermal stabilization (2009-02-10) [ Amplifiers/Converters ]
Panel meters come in blue, green LED versions (2009-02-10) [ T&M ]

Target enrichment tool eases DNA sequencing (2009-02-10) [ T&M ]
Audio connectors handle harsh field use (2009-02-10) [ Networks ]
Module family suits 3G/4G products (2009-02-10) [ RF/Microwave ]
Plans for Swift, Sparrow cores unveiled (2009-02-10) [ Controls/MCUs ]
Smart sensor integrates DSP with imager (2009-02-10) [ Sensors/MEMS ]

DTV media browser comes in STB edition, too (2009-02-10) [ Embedded ]
Court halts Rambus case vs. memory makers (2009-02-10) [ Memory/Storage ]
Sony develops vein authentication tech (2009-02-10) [ Embedded ]
Building integrated PV hotspots emerging in Europe (2009-02-10) [ Power/Alternative Energy ]
Location-centric phones coming soon (2009-02-10) [ RF/Microwave ]

Micronas exits consumer biz, halves workforce (2009-02-10) [ Manufacturing/Packaging ]
China details applied R&D projects (2009-02-10) [ EDA/IP ]
Smart phones keep IC suppliers afloat (2009-02-10) [ Optoelectronics/Displays ]
Buzz: Intel to close China plant (2009-02-10) [ T&M ]
Will energy costs revive home automation? (2009-02-09) [ Power/Alternative Energy ]

Backplane 101: RapidIO, PCIe, Ethernet (2009-02-09) [ Interface ]
Integrated equalizer IC simplifies 10G SFP+ design (2009-02-09) [ Networks ]
Compact snap switches last up to 50,000 cycles (2009-02-09) [ Networks ]
Flexible DACs are pin, software-compatible (2009-02-09) [ Amplifiers/Converters ]
Thin-film batteries highlight rechargeability (2009-02-09) [ Power/Alternative Energy ]

New solutions to cut PC power consumption (2009-02-09) [ Power/Alternative Energy ]
Here come the 'first' 46nm DRAM modules (2009-02-09) [ Memory/Storage ]
Converter chip brings cleaner, accurate images (2009-02-09) [ Amplifiers/Converters ]
ASSP reduces image, video blurring (2009-02-09) [ FPGAs/PLDs ]
LG Display, Cree ink LED agreement (2009-02-09) [ Manufacturing/Packaging ]

PV panel revenue to plunge in '09 (2009-02-09) [ Power/Alternative Energy ]
ADI slams lawsuit vs. Hittite (2009-02-09) [ RF/Microwave ]
'First' 300mm MTJ fab in U.S. unveiled (2009-02-09) [ Manufacturing/Packaging ]
Downturn forces On Semi to close fab (2009-02-09) [ Manufacturing/Packaging ]
Coming soon: 25Gbit/s backplanes (2009-02-09) [ Networks ]

Gov't steps in Japan-Taiwan DRAM talks (2009-02-09) [ Memory/Storage ]
Intel keeps 32nm launch promise (2009-02-09) [ Processors/DSPs ]
Mobile's eight (2009-02-06) [ RF/Microwave ]
Freescale will beat the blues away (2009-02-06) [ RF/Microwave ]
Tiny digicam goes big in integration (2009-02-06) [ Optoelectronics/Displays ]

Is it possible to build a $20 laptop? (2009-02-06) [ Manufacturing/Packaging ]
Keeping the control ramp right (2009-02-06) [ Power/Alternative Energy ]
16bit MCUs prolong battery life in mobile (2009-02-06) [ Controls/MCUs ]
Capacitors handle high peak current, repetition rates (2009-02-06) [ Amplifiers/Converters ]
Agilent rolls million-bit-per-minute SI simulator (2009-02-06) [ T&M ]

LCDs with white LEDs tout 50% power savings (2009-02-06) [ Optoelectronics/Displays ]
Dual operating modes define car senor (2009-02-06) [ Sensors/MEMS ]
A/D technology is ultrafast (2009-02-06) [ EDA/IP ]
Samsung champions 40nm DRAM (2009-02-06) [ Memory/Storage ]
3D sensor moves from car to CE (2009-02-06) [ Sensors/MEMS ]

Gartner: Top OEMs spent $92B for chips (2009-02-06) [ Manufacturing/Packaging ]
Good news, bad news over at Qimonda (2009-02-06) [ Manufacturing/Packaging ]
CAS revs up solar energy drive (2009-02-06) [ Power/Alternative Energy ]
Atmel scouts potential buyers for ASIC biz (2009-02-06) [ Manufacturing/Packaging ]
SemiBuzz: Micron mulls Spansion takeover (2009-02-06) [ Memory/Storage ]

Report: TI France workers lament job cuts (2009-02-06) [ Manufacturing/Packaging ]
Elpida seeks gov't bailout, mergers (2009-02-06) [ Memory/Storage ]
Rhines: EDA innovation will continue (2009-02-06) [ EDA/IP ]
Glowing in EDA negativity (2009-02-05) [ EDA/IP ]
Wrestling with signal integrity issues (2009-02-05) [ Interface ]

Creating a resource efficient home (2009-02-05) [ Embedded ]
Secure supervisor packs SRAM, tamper-detection (2009-02-05) [ Embedded ]
Z-Foil resistors boast ±0.005% tolerance (2009-02-05) [ Amplifiers/Converters ]
Server gets NEBS Level 3 certification (2009-02-05) [ Embedded ]
Integrated protection device fits mobile apps (2009-02-05) [ Amplifiers/Converters ]

Sensor system speeds dev't process (2009-02-05) [ T&M ]
Serial BERT targets high-speed digital interfaces (2009-02-05) [ T&M ]
Tactile switch complies with RoHS (2009-02-05) [ Power/Alternative Energy ]
PI tool for PCB promises accuracy (2009-02-05) [ EDA/IP ]
Samsung to manufacture PL chips for Xilinx (2009-02-05) [ Manufacturing/Packaging ]

EPRI joins group developing language for home nets (2009-02-05) [ Networks ]
Atmel acquires Zigbee IP from LuxLabs (2009-02-05) [ RF/Microwave ]
Mobile wireless biz sprouts from ST-Ericsson JV (2009-02-05) [ RF/Microwave ]
Cheaper thin-film solar cells topple crystalline (2009-02-05) [ Power/Alternative Energy ]
Analysis: Motorola draws final card (2009-02-05) [ Manufacturing/Packaging ]

Top Japan electronics companies see red (2009-02-05) [ Manufacturing/Packaging ]
EC: No financial aid for Qimonda (2009-02-05) [ Manufacturing/Packaging ]
Power up your digital home (2009-02-04) [ RF/Microwave ]
Frequency domain tutorial: Understanding spectral components (Part II) (2009-02-04) [ RF/Microwave ]
The role of semiconductors in energy conservation (2009-02-04) [ Power/Alternative Energy ]

FPD growth swerves to the slow lane (2009-02-04) [ Optoelectronics/Displays ]
Agreements settle Micron-Mosaid litigation (2009-02-04) [ Sensors/MEMS ]
Canadian Solar launches new PV R&D center (2009-02-04) [ Power/Alternative Energy ]
GPS module zooms into auto industry (2009-02-04) [ RF/Microwave ]
Analysis: What's in store for IBM's chip unit? (2009-02-04) [ Manufacturing/Packaging ]

Consumer, mobile electronics propel MEMS market (2009-02-04) [ Sensors/MEMS ]
Will $20 laptop solve India's education woes? (2009-02-04) [ Embedded ]
Renesas details restructuring plans (2009-02-04) [ Manufacturing/Packaging ]
Triple buck regulator provides adjustable outputs (2009-02-04) [ Power/Alternative Energy ]
GPS contact transmits, receives signals above 1.8GHz (2009-02-04) [ RF/Microwave ]

Audio line driver saves space in multimedia apps (2009-02-04) [ Amplifiers/Converters ]
ADC drivers claim highest accuracy conversion (2009-02-04) [ Amplifiers/Converters ]
'Promising' memory interface gears for mobiles (2009-02-04) [ Memory/Storage ]
Tracking tech IP targets handset RF front ends (2009-02-04) [ RF/Microwave ]
Next-gen Virtex, Spartan FPGAs launched (2009-02-04) [ FPGAs/PLDs ]

'My Wi-Fi' to enable traveling PANs (2009-02-04) [ RF/Microwave ]
High-current winged inductor saves power, space (2009-02-03) [ Amplifiers/Converters ]
Level-shifter delivers GIP tech for LCD TVs (2009-02-03) [ Optoelectronics/Displays ]
1.25A step-down regulators fit battery apps (2009-02-03) [ Power/Alternative Energy ]
Protection device ensures safe charging (2009-02-03) [ Amplifiers/Converters ]

SRAM devices ups system's available RAM (2009-02-03) [ Memory/Storage ]
Redesigned RFID devices don ISO functionality (2009-02-03) [ RF/Microwave ]
Tzero to sample UWB chip consuming <1W (2009-02-03) [ RF/Microwave ]
'First' 2Tbyte HDD is environment-friendly (2009-02-03) [ Memory/Storage ]
U.S. Army invests in flexible electronics R&D (2009-02-03) [ Manufacturing/Packaging ]

Synopsys, ST team up on SI sign-off tools (2009-02-03) [ EDA/IP ]
RF remotes: Move over, IR (2009-02-03) [ RF/Microwave ]
AsTEK buys Leadis' display driver biz (2009-02-03) [ Optoelectronics/Displays ]
Fujitsu streamlines fab operations (2009-02-03) [ Manufacturing/Packaging ]
Panelists push for laser diode foundry (2009-02-03) [ Manufacturing/Packaging ]

Will Qimonda break up? (2009-02-03) [ Manufacturing/Packaging ]
Freescale mulls options on wireless biz exit (2009-02-03) [ Manufacturing/Packaging ]
Mobile handset winners and losers of 2008 (2009-02-02) [ RF/Microwave ]
Virtus to push Hong Kong as logistics hub (2009-02-02) [ Sensors/MEMS ]
Synochip taps ARC license to build SoC for security (2009-02-02) [ Embedded ]

Sharp, Sony postpone LCD JV (2009-02-02) [ Optoelectronics/Displays ]
Intel builds open labs in Europe (2009-02-02) [ Manufacturing/Packaging ]
Intellectual Ventures acquires Transmeta IC patents (2009-02-02) [ EDA/IP ]
Toshiba, SanDisk update NAND fab JV (2009-02-02) [ Manufacturing/Packaging ]
Experts see bumpy ride to silicon photonics (2009-02-02) [ Manufacturing/Packaging ]

Class-D audio amp handles up to 6.5Vdc (2009-02-02) [ Amplifiers/Converters ]
Compact click, pop eliminator fits portable apps (2009-02-02) [ Amplifiers/Converters ]
Design kit with light reflection eases color recognition (2009-02-02) [ EDA/IP ]
Design tools simplify RF systems dev't (2009-02-02) [ EDA/IP ]
Now sampling: base station amps with >40% efficiency (2009-02-02) [ RF/Microwave ]

Analysis solution provides precision for serial links (2009-02-02) [ EDA/IP ]
Blue laser to bring projectors to mobiles (2009-02-02) [ Optoelectronics/Displays ]
'First' 4Gbit DDR3 developed (2009-02-02) [ Memory/Storage ]

--- Total 128 records ---

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