2009-03-01-10 Article review - EE Times-Asia

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Jun 23,2016

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Article review (Sorted By Date)

Recession calls for balance (2009-03-10) [ EDA/IP ]
Fear not! The replacement is here (2009-03-10) [ RF/Microwave ]
Submarine cable to link Tunisia, Italy (2009-03-10) [ Networks ]
iSuppli posts positive outlook for smart phones (2009-03-10) [ RF/Microwave ]
Gemalto to obtain NXP's mobile services biz (2009-03-10) [ RF/Microwave ]

Murata, CSR fete partnership milestone (2009-03-10) [ Manufacturing/Packaging ]
Bad news for Japan tool, materials markets (2009-03-10) [ Manufacturing/Packaging ]
Graphics chipset: end in sight? (2009-03-10) [ Optoelectronics/Displays ]
Elpida, Micron vie for Taiwan DRAM rule (2009-03-10) [ Memory/Storage ]
Analyst: Spansion has three options (2009-03-10) [ Manufacturing/Packaging ]

Digital radio test covers FM land mobile (2009-03-10) [ T&M ]
DC/DC regulator is electromagnetic compliant (2009-03-10) [ Power/Alternative Energy ]
Probe system meets new network protocols (2009-03-10) [ T&M ]
Measure subsystem handles up to 576 channels (2009-03-10) [ T&M ]
8bit MCUs include RTCC, other peripherals (2009-03-10) [ Controls/MCUs ]

Transceivers tout integrated power converter (2009-03-10) [ RF/Microwave ]
Chips eye computationally intensive apps (2009-03-10) [ Interface ]
Multicore drives customizable hearing aid (2009-03-10) [ Embedded ]
Is LTE crushing WiMAX? (2009-03-09) [ RF/Microwave ]
30MW PV plant to rise in Austin, Texas (2009-03-09) [ Power/Alternative Energy ]

Intel invests in high-performance computing R&D (2009-03-09) [ Embedded ]
Murata, Lineage ink PoL power licensing deal (2009-03-09) [ Power/Alternative Energy ]
ARM-based netbooks face software roadblock (2009-03-09) [ Embedded ]
VDC: Embedded processors defy downturn (2009-03-09) [ Embedded ]
Report: Taiwan plans DRAM venture (2009-03-09) [ Memory/Storage ]

Embedded, connectivity ICs shine in gloomy market (2009-03-09) [ RF/Microwave ]
Switches come in manual, electrical versions (2009-03-09) [ Networks ]
Oscillator touts low BER at high-speed transfers (2009-03-09) [ Amplifiers/Converters ]
Crypto security solution prevents firmware theft (2009-03-09) [ Embedded ]
Touch sensing software for MCUs cuts BOM cost (2009-03-09) [ Sensors/MEMS ]

Capacitors reduce acoustic noise in CE apps (2009-03-09) [ Embedded ]
Front-end modules address size demands (2009-03-09) [ RF/Microwave ]
Single board computer designed for portables (2009-03-09) [ Embedded ]
Conversion algorithm to boot conventional TVs (2009-03-09) [ Embedded ]
Performing DAC operations with CPLDs (2009-03-06) [ FPGAs/PLDs ]

Multicamera system boosts safe driving (2009-03-06) [ Optoelectronics/Displays ]
Digital power solution saves energy, cuts CO<SUB>2</SUB> emission (2009-03-06) [ Power/Alternative Energy ]
Content processor now supports RMI multicores (2009-03-06) [ Processors/DSPs ]
SBC tailored for low-end PC/104 market (2009-03-06) [ Embedded ]
'First' quarter-inch image sensors integrate EDoF (2009-03-06) [ Sensors/MEMS ]

RF mixers fit for high-dynamic range apps (2009-03-06) [ RF/Microwave ]
Software platform to drive in-car infotainment (2009-03-06) [ Embedded ]
Platform aims to cut PHY design time (2009-03-06) [ RF/Microwave ]
NEC LCD restructures, to close Kagoshima plant (2009-03-06) [ Manufacturing/Packaging ]
Bosch taps Lam's deep silicon etch system (2009-03-06) [ Manufacturing/Packaging ]

Nokia Siemens supports TD-LTE tech rollout (2009-03-06) [ RF/Microwave ]
120Hz panel shipments reached 3.3M in Q4 08 (2009-03-06) [ Optoelectronics/Displays ]
AMD foundry spinoff christened 'GlobalFoundries' (2009-03-06) [ Manufacturing/Packaging ]
What will TSMC gain from Intel deal? (2009-03-06) [ Manufacturing/Packaging ]
Litho woes: R&D gap, downturn (2009-03-06) [ Manufacturing/Packaging ]

Analysis: Should NXP file for bankruptcy? (2009-03-06) [ Manufacturing/Packaging ]
Germany is crowned solar power star (2009-03-05) [ Power/Alternative Energy ]
Freescale, arivus develop OFDM PLC solutions (2009-03-05) [ Networks ]
Agreement promotes standard specs for RF remotes (2009-03-05) [ RF/Microwave ]
AMD transaction sets stage for The Foundry Company (2009-03-05) [ Manufacturing/Packaging ]

Energy efficiency center rises in Dresden (2009-03-05) [ Power/Alternative Energy ]
Analysis: Intel-ARM rivalry heats up (2009-03-05) [ Processors/DSPs ]
Intel's Barrett: Invest in education, R&D (2009-03-05) [ Manufacturing/Packaging ]
Firms team on car infotainment common platform (2009-03-05) [ Embedded ]
DC/DC regulators withstand extreme temp (2009-03-05) [ Power/Alternative Energy ]

Free IAR Workbench supports LEGO Mindstorms (2009-03-05) [ Embedded ]
IP access control ensures high security at low cost (2009-03-05) [ Embedded ]
High-voltage photocouplers meet UL safety standards (2009-03-05) [ Optoelectronics/Displays ]
Echelon's LonWorks suite gets a makeover (2009-03-05) [ Networks ]
Low-cost DaVinci packs increased encoding power (2009-03-05) [ Controls/MCUs ]

Industrial interface converter is ruggedized (2009-03-05) [ Interface ]
Fourth-gen MCUs achieve up to 100MHz (2009-03-05) [ Embedded ]
Make engineering fun for kids (2009-03-04) [ EDA/IP ]
Achieve differentiation through IP reuse (2009-03-04) [ EDA/IP ]
Micro detect switch packs extended life cycles (2009-03-04) [ Networks ]

Atom-powered modules fit for 'light' computing apps (2009-03-04) [ Embedded ]
Audio selector saves PCB space, costs (2009-03-04) [ Amplifiers/Converters ]
Oscillators cut current use to 5&#181A (2009-03-04) [ Amplifiers/Converters ]
Chip LEDs tout brightness, energy efficiency (2009-03-04) [ Optoelectronics/Displays ]
Flyback DC/DC controller suitable for several apps (2009-03-04) [ Power/Alternative Energy ]

Atom supports variety of packages, temp (2009-03-04) [ Processors/DSPs ]
Chips link analog phones to ADSL (2009-03-04) [ Amplifiers/Converters ]
Handset-based navigation gains momentum (2009-03-04) [ RF/Microwave ]
NEC picks Virage to provide IP for 40nm (2009-03-04) [ EDA/IP ]
Intel, TSMC to collaborate on Atom (2009-03-04) [ Embedded ]

Scientists shed light on nano-thermal management (2009-03-04) [ EDA/IP ]
Deconstructing source-mask optimization tech (2009-03-04) [ Manufacturing/Packaging ]
Consortium eyes Qimonda PV operations (2009-03-04) [ Power/Alternative Energy ]
Fabless firms inch up top IC vendor list (2009-03-04) [ Manufacturing/Packaging ]
Analyst confident on RF rebound in '09 (2009-03-04) [ RF/Microwave ]

Intel vs. Qualcomm (2009-03-03) [ Manufacturing/Packaging ]
Striving for wireless glory (2009-03-03) [ RF/Microwave ]
Electronic babble? (2009-03-03) [ EDA/IP ]
Power modules come in eco-friendly packages (2009-03-03) [ Power/Alternative Energy ]
MIMO antennas hype improved data throughput (2009-03-03) [ RF/Microwave ]

Reflective memory PMC ensures data security (2009-03-03) [ Memory/Storage ]
Self-test device packs CPU interface support (2009-03-03) [ T&M ]
EEPROM devices tout 1.5V operating voltage (2009-03-03) [ Memory/Storage ]
Tyco unleashes cabling system's new version (2009-03-03) [ Interface ]
Toshiba expands MOSFET lines (2009-03-03) [ Amplifiers/Converters ]

A/V interface suits advanced security systems (2009-03-03) [ Interface ]
Sematech, Asahi Glass to improve EUV mask blank yield (2009-03-03) [ Manufacturing/Packaging ]
China's car electronics swerves to the slow lane (2009-03-03) [ Embedded ]
Tokyo Electron, Oerlikon Solar team up for PV (2009-03-03) [ Manufacturing/Packaging ]
22nm chips to be developed by trio (2009-03-03) [ EDA/IP ]

TSMC details litho roadmap, taps maskless (2009-03-03) [ Manufacturing/Packaging ]
Intel dips $62.9M R&D investment in Ireland (2009-03-03) [ Manufacturing/Packaging ]
Spansion files for bankruptcy (2009-03-03) [ Manufacturing/Packaging ]
Will Nokia deal boost Qualcomm market share? (2009-03-03) [ RF/Microwave ]
Bleak week for memory chipmakers (2009-03-02) [ Manufacturing/Packaging ]

Ref design fuses LCD power supply, inverter (2009-03-02) [ Optoelectronics/Displays ]
High-efficiency power supplies flaunt slim form (2009-03-02) [ Power/Alternative Energy ]
Customizable MCU dev't kit packs 2M logic gates (2009-03-02) [ Controls/MCUs ]
ADC claims highest SNR at over 500MHz (2009-03-02) [ Amplifiers/Converters ]
Software tool accelerates ECU efficiency (2009-03-02) [ Processors/DSPs ]

Camera platform features enhanced processing (2009-03-02) [ Embedded ]
DC motor driver boasts 500mA output currents (2009-03-02) [ Power/Alternative Energy ]
Verification tools receive upgrades (2009-03-02) [ EDA/IP ]
Carl Zeiss embarks on microscopy project (2009-03-02) [ T&M ]
IP shipments to see double by 2012 (2009-03-02) [ EDA/IP ]

Lab makes room for Agilent oscilloscopes (2009-03-02) [ T&M ]
Auto semi faces growth brakes (2009-03-02) [ Sensors/MEMS ]
Opinion: Android won't be stuck in handsets (2009-03-02) [ Embedded ]
ICs could reap $2B in alternative energy (2009-03-02) [ Power/Alternative Energy ]
Panelists skeptical on next-gen litho (2009-03-02) [ Manufacturing/Packaging ]

Intel contests 'netbook' copyright claims (2009-03-02) [ Embedded ]

--- Total 121 records ---

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