2009-04-01-10 Article review - EE Times-Asia

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Article review (Sorted By Date)

Unlock Micron's 50nm DRAM technology (2009-04-09) [ Memory/Storage ]
Power Tip #3: Avoiding oscillation issues in input filters (2009-04-09) [ Amplifiers/Converters ]
7W diode laser tailored for medical market (2009-04-09) [ Optoelectronics/Displays ]
Ultrathin ceramic capacitors deliver 10nF capacitance (2009-04-09) [ Power/Alternative Energy ]
Industrial controller packs Intel Core Duo processor (2009-04-09) [ Controls/MCUs ]

High power amp uses dual-sided bias architecture (2009-04-09) [ Amplifiers/Converters ]
New standard to reduce handhelds' power consumption (2009-04-09) [ Embedded ]
Survey: Mobile phone users want Wi-Fi (2009-04-09) [ RF/Microwave ]
Micron veers away from Taiwan DRAM venture (2009-04-09) [ Memory/Storage ]
Smart grid: ready for take off? (2009-04-09) [ Networks ]

Single-sided slide switch flaunts thinner design (2009-04-08) [ Networks ]
SoCs support Full HD, WXGA resolutions for LCD TVs (2009-04-08) [ Amplifiers/Converters ]
ATCA SBC with Intel Xeon designed for 4G apps (2009-04-08) [ Embedded ]
DSP suits audio conferencing, power protection apps (2009-04-08) [ Processors/DSPs ]
Network platform touts more performance per watt (2009-04-08) [ Processors/DSPs ]

Integrated RF LDMOS bias controllers debut (2009-04-08) [ RF/Microwave ]
New flexible DSAs expand Peregrine's lineup (2009-04-08) [ RF/Microwave ]
TV chip manufacturing competition sizzles (2009-04-08) [ Optoelectronics/Displays ]
Canadian Solar to supply solar panels to Sichuan (2009-04-08) [ Power/Alternative Energy ]
Research to reform embedded systems (2009-04-08) [ Embedded ]

Where did memory vendors go wrong? (2009-04-08) [ Memory/Storage ]
Students build solar-powered race car (2009-04-08) [ Power/Alternative Energy ]
Japan team develops solar cell out of optical fiber (2009-04-08) [ Power/Alternative Energy ]
What's next after IBM-Sun merger talks fizzle? (2009-04-08) [ Embedded ]
Bluetooth headset is microphone-free (2009-04-07) [ RF/Microwave ]

AC ammeters equipped with over current alarm (2009-04-07) [ T&M ]
Development kit supports ARM-based MCUs (2009-04-07) [ EDA/IP ]
Debug tech support caters to MIPS32 24KE (2009-04-07) [ EDA/IP ]
Serial module designed for legacy devices (2009-04-07) [ Interface ]
Antenna switch replaces traditional solution (2009-04-07) [ RF/Microwave ]

Tool deals with stack overflow problems (2009-04-07) [ Embedded ]
Singapore R&D institute adopts Synopsys tools (2009-04-07) [ EDA/IP ]
'Green' solutions go 'smart' (2009-04-07) [ Embedded ]
TI's Philippine building bags LEED certification (2009-04-07) [ Manufacturing/Packaging ]
HD consumer electronics set for triple growth (2009-04-07) [ Optoelectronics/Displays ]

ST, Infineon, AMSL ratings go sour (2009-04-07) [ Manufacturing/Packaging ]
Continental opens new China R&D center (2009-04-07) [ Controls/MCUs ]
Researchers tap viruses for 'green' batteries (2009-04-07) [ Power/Alternative Energy ]
GE, Intel join forces for telehealth (2009-04-06) [ Embedded ]
Varistors boast ultralow leakage current (2009-04-06) [ Amplifiers/Converters ]

User-customizable verification module to debut (2009-04-06) [ T&M ]
Ruggedized board befits mission-critical environments (2009-04-06) [ Embedded ]
Devices expand Dynastron image sensor lineup (2009-04-06) [ Sensors/MEMS ]
Analysis: PV market to tighten in '09 (2009-04-06) [ Power/Alternative Energy ]
Renesas gets 'pro-active' with new patent program (2009-04-06) [ EDA/IP ]

Wireless, MEMS advancements boost energy harvesting (2009-04-06) [ Sensors/MEMS ]
6-slot ATCA backplane comes in Mesh topology (2009-04-03) [ Embedded ]
Buck-boost controller promises up to 98% efficiency (2009-04-03) [ Power/Alternative Energy ]
LDO regulator equipped with power save mode (2009-04-03) [ Power/Alternative Energy ]
Step-up converter delivers low-noise output (2009-04-03) [ Power/Alternative Energy ]

DirectPath tech powers Class-G headphone amps (2009-04-03) [ Amplifiers/Converters ]
Serial FRAM flaunts higher-speed read/write (2009-04-03) [ Memory/Storage ]
Audio subsystems aim to simplify design (2009-04-03) [ Embedded ]
Satellite-terrestrial mobile platform is SDR-based (2009-04-03) [ RF/Microwave ]
0.18µm embedded flash suits power-sensitive apps (2009-04-03) [ Memory/Storage ]

Asia to bid farewell to NECCAP PCs (2009-04-03) [ Embedded ]
IDC: Southeast Asia beams with bright telecom market (2009-04-03) [ RF/Microwave ]
Toshiba to acquire Panasonic's share in LCD JV (2009-04-03) [ Optoelectronics/Displays ]
Korea, Taiwan panel makers to boost output in '09 (2009-04-03) [ Manufacturing/Packaging ]
Nokia slashes $5B in contract manufacturing (2009-04-03) [ Manufacturing/Packaging ]

Taiwan Memory taps Elpida as tech partner (2009-04-03) [ Memory/Storage ]
Intel stays on top of MPU market in '08 (2009-04-03) [ Processors/DSPs ]
LCD controller driver packs key scan function (2009-04-02) [ Optoelectronics/Displays ]
GPRS Edge modem suits M2M apps (2009-04-02) [ RF/Microwave ]
MEMS motion sensor delivers analog output (2009-04-02) [ Sensors/MEMS ]

UHF RFID reader includes USB interface (2009-04-02) [ RF/Microwave ]
Next-gen DSCs boast flexibility (2009-04-02) [ Power/Alternative Energy ]
45nm-based comms processor aims at 3G, 4G (2009-04-02) [ Controls/MCUs ]
MEMS oscillator offered in smaller packages (2009-04-02) [ RF/Microwave ]
Chips jumpstart commercial FCoE (2009-04-02) [ FPGAs/PLDs ]

Dolby's HD audio technologies penetrate China (2009-04-02) [ Processors/DSPs ]
Wafer-level optics tech licensed to Qtech (2009-04-02) [ Optoelectronics/Displays ]
China outperforms U.S. in 2008 auto production (2009-04-02) [ Embedded ]
Cambodia's telecoms sector gets a shot in the arm (2009-04-02) [ RF/Microwave ]
DRAM makers to keep low utilization rates in 2009 (2009-04-02) [ Memory/Storage ]

Intel drives broadband initiative in India (2009-04-02) [ RF/Microwave ]
IC rebound: Is it for real? (2009-04-02) [ Manufacturing/Packaging ]
Globalfoundries assures commitment to Dresden (2009-04-02) [ Manufacturing/Packaging ]
Design 101: Class D amplifiers (2009-04-01) [ Amplifiers/Converters ]
Automotive industry bids 5V NOR flash goodbye (2009-04-01) [ Memory/Storage ]

Touch panel packs multi-touch input functions (2009-04-01) [ Sensors/MEMS ]
LTE test system promises complete RF testing (2009-04-01) [ T&M ]
Driver, receiver ICs handle video signal transmission (2009-04-01) [ Amplifiers/Converters ]
5V NOR flash tailored for automotive, embedded apps (2009-04-01) [ Memory/Storage ]
Graphics IP cores come in multiprocessing versions (2009-04-01) [ EDA/IP ]

MEMS user interface enables control functions (2009-04-01) [ Sensors/MEMS ]
QuickLogic platform supports Qualcomm mobile processors (2009-04-01) [ Interface ]
Mobile music market meets DAC with 102dB SNR (2009-04-01) [ Embedded ]
Collaboration to drive interconnect solutions in autos (2009-04-01) [ FPGAs/PLDs ]
Joint effort aims to enable 3D semiconductors (2009-04-01) [ Manufacturing/Packaging ]

Winners and losers of the solar cell market (2009-04-01) [ Power/Alternative Energy ]
Contract to create Asian submarine cable net system (2009-04-01) [ Networks ]
Avnet, HKPC drive LED lighting in Hong Kong (2009-04-01) [ Optoelectronics/Displays ]
Tech firms, universities seek cloud computing standards (2009-04-01) [ Embedded ]
Gartner: Asia-Pacific IC market to drop 23% (2009-04-01) [ Manufacturing/Packaging ]

Analysis: Numonyx braces for stormy 2009 (2009-04-01) [ Memory/Storage ]

--- Total 96 records ---

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