2012-10-11-20 Article review - EE Times-Asia

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Article review (Sorted By Date)

Interface Bridge SoC boasts 10 interfaces (2012-10-20) [ Interface ]
Renesas announces power supply ICs (2012-10-20) [ Power/Alternative Energy ]
Qualcomm reveals partners for Internet of Everything (2012-10-20) [ RF/Microwave ]
Demand surge lifts NAND flash contract price (2012-10-20) [ Memory/Storage ]
Team up to fast track mobile infrastructure, data centre network performance (2012-10-19) [ Manufacturing/Packaging ]

12W LED driver eases design cycle for OEM lighting apps (2012-10-19) [ Power/Alternative Energy ]
Flash memory market dips this year (2012-10-19) [ Memory/Storage ]
Cellular base stations boost market for remote radio heads (2012-10-19) [ RF/Microwave ]
Infineon expands 3<sup>rd</sup> gen RC conducting IGBT portfolio (2012-10-19) [ Power/Alternative Energy ]
AVX's latest TCXO series ready for wide range apps (2012-10-19) [ Interface ]

7 suppliers chosen by China Mobile for its TD-LTE trials (2012-10-19) [ Networks ]
ASML pumps up EUV initiative with Cymer purchase (2012-10-19) [ Optoelectronics/Displays ]
Calxeda targets 2014 for 64bit SoC launch (2012-10-19) [ Processors/DSPs ]
Employ hierarchical methods for power intent specification (2012-10-19) [ EDA/IP ]
IGBTs aimed at appliance motor drives (2012-10-18) [ Power/Alternative Energy ]

Altera rolls 28nm FPGA (2012-10-18) [ FPGAs/PLDs ]
In cell touch rises, G/G structure falls, says analyst (2012-10-18) [ Manufacturing/Packaging ]
No slowing down for car sensor market this year (2012-10-18) [ Sensors/MEMS ]
Intel beats Q3 forecast but still faces tough conditions (2012-10-18) [ Manufacturing/Packaging ]
Foxconn confirms employment of underage workers (2012-10-18) [ Manufacturing/Packaging ]

Can streaming sticks derail smart TV makers? (2012-10-18) [ Processors/DSPs ]
AMD to cut 20 per cent of workforce, says report (2012-10-18) [ Processors/DSPs ]
ARM's V8 to be used for TSMC's 16nm FinFET (2012-10-18) [ Manufacturing/Packaging ]
TI's latest SoC ready for smart e-meter apps (2012-10-18) [ Embedded ]
Fujitsu's FRAM ready to operate in wide voltage range (2012-10-18) [ Memory/Storage ]

Understanding SAR and delta-sigma ADC signal path (2012-10-18) [ Amplifiers/Converters ]
Using LMH6882 eval board (2012-10-18) [ Amplifiers/Converters ]
SunPower outlines massive reorganization for Philippine fab (2012-10-17) [ Power/Alternative Energy ]
Fault management IC promises smarter, safer LED lighting (2012-10-17) [ Power/Alternative Energy ]
Broadcom, Hyundai team up for next-gen connected car (2012-10-17) [ Embedded ]

Mobile handset IC market to top $35B this year (2012-10-17) [ RF/Microwave ]
Consumer cloud market soars in 1H12, says report (2012-10-17) [ Memory/Storage ]
TSMC names EDA partners for CoWoS, 20nm (2012-10-17) [ EDA/IP ]
FOD8316 optocoupler features isolated gate driving (2012-10-17) [ Power/Alternative Energy ]
Jolla eager to join the smartphone circus (2012-10-17) [ EDA/IP ]

Opinion: Apple needs to drop Samsung as display supplier (2012-10-17) [ Optoelectronics/Displays ]
Super-capacitors have potential to overtake Li batteries (2012-10-17) [ Manufacturing/Packaging ]
Automotive connector cuts EV charge time to 10 minutes (2012-10-17) [ Interface ]
Imagination Technologies prepping GPUs for 28nm (2012-10-17) [ Embedded ]
Japanese investment group to bail out Renesas (2012-10-17) [ Manufacturing/Packaging ]

Exploring split-gate thin-film storage (2012-10-17) [ Memory/Storage ]
Characterizing LMH6881 differential amp (2012-10-17) [ Amplifiers/Converters ]
Samsung plans new Vietnam production plant (2012-10-16) [ Manufacturing/Packaging ]
SDI reclocker with integrated eye monitor for broadcast video systems (2012-10-16) [ Optoelectronics/Displays ]
TSMC preps CoWoS test car with JEDEC Wide I/O DRAM Interface (2012-10-16) [ Interface ]

Tablets, cars to drive CMOS market growth (2012-10-16) [ Sensors/MEMS ]
maXTouch controllers support gloved finger operation (2012-10-16) [ Controls/MCUs ]
First channel emulator from Averna caters to DOCSIS industry (2012-10-16) [ T&M ]
Method to prevent solar cell degradation established (2012-10-16) [ Manufacturing/Packaging ]
Organic solar cell offers high voltage for Li-on batteries (2012-10-16) [ Optoelectronics/Displays ]

Cisco spearheaded Huawei boycott, says report (2012-10-16) [ Networks ]
Advantages of JESD204B over parallel data formats (2012-10-16) [ Interface ]
Eval module for LM34902/4 power switch (2012-10-16) [ Power/Alternative Energy ]
Cisco rumoured to be in a foundry deal with Intel (2012-10-15) [ Processors/DSPs ]
Marketability of silicon photonics near (2012-10-15) [ Optoelectronics/Displays ]

Module from Kontron extends lifecycle of PCI/ISA-based apps (2012-10-15) [ EDA/IP ]
SSD market still on track despite poor ultrabook shipments (2012-10-15) [ Processors/DSPs ]
Renesas boasts MCU-based power supply sol'n (2012-10-15) [ Power/Alternative Energy ]
TI rolls MCUs, PMICs, motor drivers (2012-10-15) [ Power/Alternative Energy ]
Plasmonics show promise for optically induced electronics (2012-10-15) [ Manufacturing/Packaging ]

64bit processor integrates GbE switch (2012-10-15) [ Processors/DSPs ]
Embedded software devt: The disciplined way (Part 1) (2012-10-15) [ Embedded ]
Goepel, Aster team up to complete upgrades to ScanVision (2012-10-15) [ EDA/IP ]
GeForce GTX 650 Ti prepped and ready for gaming season (2012-10-15) [ Processors/DSPs ]
Telecom segments to lead top-growing IC markets this year (2012-10-12) [ Manufacturing/Packaging ]

Photonic gels boast numerous applications (2012-10-12) [ Sensors/MEMS ]
PC shipments expected to drop after 11 years of plenty (2012-10-12) [ Processors/DSPs ]
ARM's new on-chip interconnect delivers Tb/s throughput (2012-10-12) [ Processors/DSPs ]
LSI, Calxeda receive licenses for ARM's on chip link (2012-10-12) [ Interface ]
Opinion: Saving Moore's Law (2012-10-12) [ Manufacturing/Packaging ]

ARM, Intel open networking, comms front in their battle (2012-10-12) [ Manufacturing/Packaging ]
Eyecheck 9xx smart cameras feature ARM powered CMOS sensor (2012-10-12) [ Sensors/MEMS ]
Peak's high power DC/DC converters integrate heatsink (2012-10-12) [ Amplifiers/Converters ]
H.264 PCI Express encoder provides dual output streams (2012-10-12) [ Controls/MCUs ]
Guarding against side-channel attacks (Part 2) (2012-10-12) [ Embedded ]

Designing base station antenna (2012-10-12) [ RF/Microwave ]
Ultra-slim PC shipments to reach 65M by 2015 (2012-10-11) [ Processors/DSPs ]
Verification debugger cuts op'n time by 40% (2012-10-11) [ EDA/IP ]
Wafer shipments to remain flat as year winds down (2012-10-11) [ Manufacturing/Packaging ]
TSMC releases 20nm, CoWoS design reference (2012-10-11) [ EDA/IP ]

ASMgrid2 Reference Designs enable smart meter BOM reduction (2012-10-11) [ Networks ]
Qualcomm leads, Intel cracks smartphone apps processor market (2012-10-11) [ Processors/DSPs ]
Atmel unveils Cortex-M4 based SoC for smart metering apps (2012-10-11) [ Embedded ]
SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps (2012-10-11) [ Manufacturing/Packaging ]
Sand 9 teams with IBM to produce MEMS timing products (2012-10-11) [ Sensors/MEMS ]

ARM's 'big.LITTLE' processor taps DVFS to save energy (2012-10-11) [ Processors/DSPs ]
Incorporating MEMS motion tracking in wearable sensors (2012-10-11) [ Sensors/MEMS ]

--- Total 87 records ---

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