2012-10-21-31 Article review - EE Times-Asia

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EE Times-Asia Home > Article review?>?2012-10-21-31

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Article review (Sorted By Date)

Intel sets sights on 48-core mobile processors (2012-10-31) [ Processors/DSPs ]
Chinese smartphones to gain >30% of global share in 2013 (2012-10-31) [ RF/Microwave ]
Global TV demand to flatten next year, says analyst (2012-10-31) [ Optoelectronics/Displays ]
Merritt: Two Burning questions for ARM (2012-10-31) [ Processors/DSPs ]
AMD jumps into ARM server chip market (2012-10-31) [ FPGAs/PLDs ]

Apple cuts ties with iOS and retail VPs (2012-10-31) [ EDA/IP ]
Opinion: NXP's China conundrum (2012-10-31) [ Manufacturing/Packaging ]
NI invests in the long term with new Penang facility (2012-10-31) [ Manufacturing/Packaging ]
Win8 not expected to spark DRAM shipments (2012-10-31) [ Memory/Storage ]
ST readies MEMS for incoming Win8 Tablets (2012-10-31) [ Sensors/MEMS ]

Dynamic Bus Voltage boast better flexibility, performance (2012-10-31) [ Interface ]
Solve random tests' failure to identify regression (2012-10-31) [ T&M ]
Enhancing eSATA cable drive (2012-10-31) [ Interface ]
Micronas 8bit MCU incorporates power transistors (2012-10-30) [ Controls/MCUs ]
Semtech IR decoder enables high-resolution sensing (2012-10-30) [ Sensors/MEMS ]

Diodes releases miniature package for mobile devices (2012-10-30) [ Power/Alternative Energy ]
ARM, Red Hat, AppliedMicro form server platform alliance (2012-10-30) [ Embedded ]
ST's team of experts work on digital-security SHA-3 (2012-10-30) [ EDA/IP ]
Apple's Q3 smartphone shipments only half of Samsung's (2012-10-30) [ RF/Microwave ]
NXP 2.0 ready by 2013, says CEO (2012-10-30) [ Manufacturing/Packaging ]

Freescale's restructuring strategy: drop DSPs, cut jobs (2012-10-30) [ Manufacturing/Packaging ]
SSD targets commercial security apps (2012-10-30) [ Memory/Storage ]
KALRAY completes 256-core SoC using Mentor's sol'ns (2012-10-30) [ Processors/DSPs ]
Banner outs gateway module for wireless sensors (2012-10-30) [ RF/Microwave ]
Triple-play graphics cores accelerate auto apps (2012-10-30) [ Processors/DSPs ]

Grasp voltage-ref temp drift (2012-10-30) [ Amplifiers/Converters ]
Digital accelerometer touts built-in user-controlled analytical tools (2012-10-29) [ T&M ]
Boundary scan controller boasts WLAN interface (2012-10-29) [ RF/Microwave ]
Nanorods pave the way for better LED displays (2012-10-29) [ Optoelectronics/Displays ]
Comms, car IC market to top total market growth through 2016 (2012-10-29) [ Manufacturing/Packaging ]

Imaging BGA package at multiple depths (2012-10-29) [ Manufacturing/Packaging ]
SliceKIT officially enters XMOS into the board market (2012-10-29) [ EDA/IP ]
Evervision Europe's IPCT ready for industrial, medical apps (2012-10-29) [ Sensors/MEMS ]
TI, Navetas partner up for smart grid systems (2012-10-29) [ Networks ]
ADI inaugurates design contest for universities,colleges (2012-10-29) [ EDA/IP ]

Marvell prepared for coming 'super-integration era' (2012-10-29) [ Memory/Storage ]
Will Apple stumble as it increases its iPad pace? (2012-10-29) [ Optoelectronics/Displays ]
ST's wireless slump continues, losses piling on (2012-10-29) [ Manufacturing/Packaging ]
Broadcom posts $2bn qtr despite poor economic conditions (2012-10-29) [ Manufacturing/Packaging ]
Broaden functionality of MAX9930 for CATV apps (2012-10-29) [ RF/Microwave ]

ST, Audi to speed up car IC innovation (2012-10-25) [ Embedded ]
Renesas shows next-gen MCU, MPU roadmap (2012-10-25) [ Processors/DSPs ]
Fujitsu unveils ultra-high-speed short-reach data transmission (2012-10-25) [ Networks ]
iPad mini to double 7in tablet market in 2012, 2013 (2012-10-25) [ Manufacturing/Packaging ]
Augmented reality system dev't to support manual work (2012-10-25) [ EDA/IP ]

Fischer Elektronic adds heat simulation to its services (2012-10-25) [ EDA/IP ]
Truesense latest Image sensor supports up to 28fps (2012-10-25) [ Sensors/MEMS ]
Dev Kit for MachX02 FPGA enables low-cost prototyping (2012-10-25) [ Interface ]
ARM's revenues surge on with increasing Core demand (2012-10-25) [ Processors/DSPs ]
Weak demand slumps TI, Wall Street disappointed (2012-10-25) [ Manufacturing/Packaging ]

Servergy ready to pit IBM's servers vs x86, ARM (2012-10-25) [ Processors/DSPs ]
IR's latest IPS optimised for automotive PTC heaters (2012-10-25) [ Interface ]
Extending ADC dynamic range (2012-10-25) [ Amplifiers/Converters ]
Apple reveals slightly bigger iPad Mini (2012-10-24) [ Processors/DSPs ]
Start-up focuses on data overload in silicon mfg and test (2012-10-24) [ Manufacturing/Packaging ]

Multi-channel connectors tout onboard sensor, mould ID (2012-10-24) [ Sensors/MEMS ]
Keithley combines Curve Tracer's features with parameter analyser (2012-10-24) [ T&M ]
Laser spike anneal platform features ambient control (2012-10-24) [ Manufacturing/Packaging ]
Lighting OEM Market to reach $108B by 2016 (2012-10-24) [ Manufacturing/Packaging ]
HD Oscilloscopes armed with true 12bit ADC (2012-10-24) [ T&M ]

Vishay's thin film chip resistors up to 100MOhms (2012-10-24) [ Power/Alternative Energy ]
Murata opens latest factory in the Philippines (2012-10-24) [ Manufacturing/Packaging ]
Advances in wireless bonding LED technology (2012-10-24) [ Manufacturing/Packaging ]
Uses of LMH6881 evaluation board (2012-10-24) [ Amplifiers/Converters ]
Latest Blue Pearl software boasts enhanced Path analysis (2012-10-23) [ EDA/IP ]

Research shows optical vortices on a chip (2012-10-23) [ Optoelectronics/Displays ]
Apacer unveils mSATA mini SSD module (2012-10-23) [ Memory/Storage ]
4V solid state battery boasts >1kWh/l energy density (2012-10-23) [ Power/Alternative Energy ]
ST, Soitec roll 28nm FD-SOI CMOS process thru CMP (2012-10-23) [ Manufacturing/Packaging ]
IVT sensor addresses charge, discharge cycle challenges (2012-10-23) [ T&M ]

Wolfson unveils HD audio MEMS microphones (2012-10-23) [ Sensors/MEMS ]
Asia widens its global LED production share, says report (2012-10-23) [ Manufacturing/Packaging ]
Opinion: Is NFC the successor to Bluetooth? (2012-10-23) [ RF/Microwave ]
Princeton researchers close in on quantum computing (2012-10-23) [ Processors/DSPs ]
Windows 8 ushers in end of PCs, says PC exec (2012-10-23) [ EDA/IP ]

Sony to cut 2000 jobs in Japanese HQ (2012-10-23) [ Manufacturing/Packaging ]
TCAD eases FinFET design and variability analysis (2012-10-23) [ EDA/IP ]
Functions of LMH6881 evaluation board (2012-10-23) [ Amplifiers/Converters ]
AMD deals with PC slump via job cuts, restructuring (2012-10-22) [ EDA/IP ]
Questa tools get major updates (2012-10-22) [ EDA/IP ]

LinScan tech enables high res 3D scanning (2012-10-22) [ Sensors/MEMS ]
Kistler's DTI takes up to 12 transducers (2012-10-22) [ Interface ]
Rohm's latest EEPROMs feature I2C, up to 1Mbit density (2012-10-22) [ Memory/Storage ]
Tektronix's oscilloscope offer full serial bus decode (2012-10-22) [ T&M ]
Opinion: Japan needs to bow out of the TV market (2012-10-22) [ Manufacturing/Packaging ]

Cosmic Rays offer potential aid to Japan's reactor cleanup (2012-10-22) [ Power/Alternative Energy ]
MEMS pave way for medical innovation (2012-10-22) [ Sensors/MEMS ]
Embedded software devt: The disciplined way (Part 2) (2012-10-22) [ Embedded ]
Sensor AFE with 4-wire RTD interface (2012-10-22) [ Sensors/MEMS ]

--- Total 89 records ---

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