2012-12-11-20 Article review

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Article review (Sorted By Date)

Samsung unseats Nokia as top cell phone brand this year (2012-12-20) [ Optoelectronics/Displays ]
A*STAR offers 2.5D through-silicon-interposer MPW service (2012-12-20) [ EDA/IP ]
Broadband Forum expands certification options (2012-12-20) [ Optoelectronics/Displays ]
Opinion: Apple-Nvidia chip stack venture makes sense (2012-12-20) [ Processors/DSPs ]
Wafer fab spending to recover in 2014 (2012-12-20) [ Manufacturing/Packaging ]

Singapore not lagging behind in thriving smartphone market (2012-12-20) [ Manufacturing/Packaging ]
Vishay's MPMA series boasts tight ratio tolerance (2012-12-20) [ Power/Alternative Energy ]
Globalfoundries consider SSRW tech as 3<sup>rd</sup> option (2012-12-20) [ Manufacturing/Packaging ]
Despite growth, AMOLEDs not attracting newcomers (2012-12-20) [ Manufacturing/Packaging ]
Vertical crosspoint memory for Internet of Things (2012-12-20) [ Memory/Storage ]

Site survey with handheld spectrum analyser (2012-12-20) [ T&M ]
Broadcom, Qualcomm move up in latest ranking from Gartner (2012-12-19) [ Manufacturing/Packaging ]
Embedded multi-variate analysis sol'n geared for OEMs (2012-12-19) [ Manufacturing/Packaging ]
Camera phones get a leg up thanks to embedded imaging (2012-12-19) [ Optoelectronics/Displays ]
Smart grids to reach $6.1B in storage products in 2018 (2012-12-19) [ Manufacturing/Packaging ]

TI's unveils low power bidirectional I2C isolators (2012-12-19) [ Interface ]
5.6GB/s reached by PLX, Kontron PCIe team up (2012-12-19) [ Interface ]
Singapore electronics sector still on the trench (2012-12-19) [ Manufacturing/Packaging ]
Study: Supercapacitors need to be just as stretchable (2012-12-19) [ Power/Alternative Energy ]
Lithography expert still not sold on EUV (2012-12-19) [ Manufacturing/Packaging ]

Car electronics propels design centres in emerging markets (2012-12-19) [ EDA/IP ]
Virtual prototype for Android HW-SW dev't (Part 3) (2012-12-19) [ Sensors/MEMS ]
2G/3G to 3.9G/4G base station receiver test (2012-12-19) [ T&M ]
2.4GHz WirelessUSB-NL sol'n targets wireless mice (2012-12-18) [ RF/Microwave ]
AVX touts card edge connectors (2012-12-18) [ Networks ]

Semtech unveils HB LED driver platform (2012-12-18) [ Controls/MCUs ]
Cu current collector sheds light on car battery life (2012-12-18) [ Power/Alternative Energy ]
Samsung acquires SSD firm, augments Texas fab (2012-12-18) [ Memory/Storage ]
Q4 chip revenue grimmer than expected (2012-12-18) [ Manufacturing/Packaging ]
FDSOI beneficial for FPGAs, says Altera (2012-12-18) [ FPGAs/PLDs ]

Fewer IC executives see opportunities in China (2012-12-18) [ Manufacturing/Packaging ]
Impact of crystal electrodes on PCM (Part 2) (2012-12-18) [ Memory/Storage ]
Asian smart meter market gains momentum (2012-12-17) [ Power/Alternative Energy ]
LED market to reach $11B this year (2012-12-17) [ Optoelectronics/Displays ]
Study: Industrial robots market worth $8.2 billion (2012-12-17) [ Manufacturing/Packaging ]

Panel: No single approach in future of ICs (2012-12-17) [ Manufacturing/Packaging ]
MediaTek riding high despite market downturn (2012-12-17) [ RF/Microwave ]
Sensors built to withstand high pressure washdowns (2012-12-17) [ Sensors/MEMS ]
Bulk metal foil resistors boast ±0.2ppm/°C of TCR (2012-12-17) [ T&M ]
Mill-Max USB 3.0 boasts 5Gbit/s data transfer rate (2012-12-17) [ Interface ]

Globalfoundries CEO: Time for foundry 2.0 (2012-12-17) [ EDA/IP ]
Perform automated communications measurement (2012-12-17) [ T&M ]
Accelerate program devt through instrument control (2012-12-17) [ EDA/IP ]
Low-cost parts to pave way for tablets under $150 (2012-12-14) [ Processors/DSPs ]
16bit ADCs target precision measurement apps (2012-12-14) [ Power/Alternative Energy ]

OS differentiation key to smartphone boom in 2013 (2012-12-14) [ EDA/IP ]
FDSOI workshop reveals next nodes at 14nm, 10nm (2012-12-14) [ Manufacturing/Packaging ]
IBM showcases 3D server chip stacks (2012-12-14) [ EDA/IP ]
Device makers need to become solutions providers, says exec (2012-12-14) [ Manufacturing/Packaging ]
Analyst: All-robot manufacturing floor in the near future (2012-12-14) [ Manufacturing/Packaging ]

Imec advances UHF Schottky diode, 10nm FinFETs (2012-12-14) [ RF/Microwave ]
Signal chain basics: Isolating analogue signals (2012-12-14) [ Amplifiers/Converters ]
Verify, visualise TD-LTE beamforming signals (2012-12-14) [ T&M ]
GbE switches targets cloud, infrastructure apps (2012-12-13) [ RF/Microwave ]
Toshiba unveils Qi-compliant charging chipset (2012-12-13) [ RF/Microwave ]

Mobile health devices vendors sold 30 million units (2012-12-13) [ T&M ]
TI jumps on board Alliance for Wireless Power (2012-12-13) [ Power/Alternative Energy ]
Study: InGaAs alternative to silicon at 22nm (2012-12-13) [ Manufacturing/Packaging ]
MediaTek integrates modem into latest apps SoC (2012-12-13) [ RF/Microwave ]
USB controller ICs operate at 12 Mbit/s (2012-12-13) [ Interface ]

Toshiba says MRAM future of mobile processors (2012-12-13) [ Memory/Storage ]
Huawei focuses on EU after U.S. congressional grilling (2012-12-13) [ Manufacturing/Packaging ]
ST ready to roll out 28nm FDSOI (2012-12-13) [ Manufacturing/Packaging ]
Minimising self noise for MEMS microphone apps (2012-12-13) [ Sensors/MEMS ]
Mobile transmitter integrates 60GHz RF transceiver (2012-12-12) [ RF/Microwave ]

Self-assembled monolayers create p-n junctions in graphene (2012-12-12) [ Manufacturing/Packaging ]
Motorola to cut Korea connection (2012-12-12) [ RF/Microwave ]
IBM says silicon nanophotonics ready for chip manufacturing (2012-12-12) [ Optoelectronics/Displays ]
RF power amp, device sales combine for $3B despite slow year (2012-12-12) [ Manufacturing/Packaging ]
Arasan reinforces Ethernet portfolio, adds AVB (2012-12-12) [ Interface ]

Module upgrades make for efficient dPMR radio designs (2012-12-12) [ RF/Microwave ]
Top-end controller board boasts DVI-I , HDMI support (2012-12-12) [ Optoelectronics/Displays ]
Intel tweaks 22nm tri-gate SoC for ultra-low leakage (2012-12-12) [ Power/Alternative Energy ]
Perform efficient debug of multi-core MCUs (2012-12-12) [ Embedded ]
Migrating from Agilent E4982A LCR to E4982A (2012-12-12) [ T&M ]

Diodes unveils Hall switches (2012-12-11) [ Power/Alternative Energy ]
Energy Micro, LNI to offer MCU design for medical systems (2012-12-11) [ Controls/MCUs ]
ST ends Ericsson partnership to focus on embedded (2012-12-11) [ Sensors/MEMS ]
Indonesia's businesses spent $557M on IT hardware (2012-12-11) [ Manufacturing/Packaging ]
Waveguide enables 3D focusing of light (2012-12-11) [ Optoelectronics/Displays ]

SMIC, Crocus to make MLU-based MCUs (2012-12-11) [ Memory/Storage ]
Endurance of flash memory boosted to 100M cycles (2012-12-11) [ Memory/Storage ]
Maxim video IC arm to be acquired by GEO Semi (2012-12-11) [ EDA/IP ]
3D printers to make mark in medical apps (2012-12-11) [ Manufacturing/Packaging ]
Mobile Wi-Fi, optical net markets continue to grow (2012-12-11) [ Optoelectronics/Displays ]

--- Total 87 records ---

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