2013-10-01-10 Article review - EE Times-Asia

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Article review (Sorted By Date)

IDT eases control of complex clocking sol'ns with timing platform (2013-10-10) [ Interface ]
3-axis MEMS accelerometer targets high-impact apps (2013-10-10) [ Sensors/MEMS ]
South Korean researcher develops wideband ring VCO (2013-10-10) [ RF/Microwave ]
Imec unveils 25Gb/s silicon photonics platform (2013-10-10) [ Optoelectronics/Displays ]
Crocus to begin production with SRAM, sensor offering (2013-10-10) [ Sensors/MEMS ]

KAIST builds shredder-bots to fend off jellyfish swarms (2013-10-10) [ Sensors/MEMS ]
SafeAdapt to create adaptive vehicle software architecture (2013-10-10) [ EDA/IP ]
IDT takes on wireless power market with dual-mode solution (2013-10-10) [ RF/Microwave ]
MEMS industry players eye smaller analytic instruments (2013-10-10) [ Sensors/MEMS ]
Develop touch electrodes for non-uniform surfaces (2013-10-10) [ Sensors/MEMS ]

Stratasys seeks wider reach in Asia with SG facility (2013-10-09) [ Manufacturing/Packaging ]
Touchscreen controller boasts first-rate noise rejection (2013-10-09) [ Controls/MCUs ]
Roboteq debuts expansion card for Raspberry PI (2013-10-09) [ Processors/DSPs ]
Cybersecurity MCU shipments to grow twofold by 2017 (2013-10-09) [ Controls/MCUs ]
Researchers unravel new source of extreme UV light (2013-10-09) [ Manufacturing/Packaging ]

DC/DC converter manages 3G,LTE bandwidths up to 20MHz (2013-10-09) [ Power/Alternative Energy ]
Photorelays realize isolation voltage of 5000Vrms (2013-10-09) [ Power/Alternative Energy ]
Mellanox up against Intel, Cisco in silicon photonics race (2013-10-09) [ Interface ]
Quark brings uncertainty for Intel's SoC strategy (2013-10-09) [ Processors/DSPs ]
IMEC, ASML collaborate to optimise lithography systems (2013-10-09) [ Manufacturing/Packaging ]

Understand low-power MCU benchmarking (2013-10-09) [ Power/Alternative Energy ]
Understanding flash core voltage supply (2013-10-09) [ Memory/Storage ]
Dev't board features eGaN FETs in parallel operation (2013-10-08) [ Power/Alternative Energy ]
Cable-to-board 3M interconnects allow high-density designs (2013-10-08) [ Networks ]
Pure-play foundries make headway thru increased capital buy (2013-10-08) [ Manufacturing/Packaging ]

Ultrathin insulators yield better superconducting magnets (2013-10-08) [ Manufacturing/Packaging ]
Kozio unveils versatile hardware verification solution (2013-10-08) [ T&M ]
Intel teams with Arduino to prep for the next big thing (2013-10-08) [ Processors/DSPs ]
IBM enlists universities for cognitive computing effort (2013-10-08) [ Processors/DSPs ]
Are consumers ready for self-driving cars? (2013-10-08) [ Sensors/MEMS ]

Analog influences Synopsys' move to 20nm (2013-10-08) [ EDA/IP ]
Uses of copper barrier capacitors in medical field (2013-10-08) [ Embedded ]
Migrating from S08 to Kinetis E (2013-10-08) [ Embedded ]
Ametherm intros latest surface-mount thermistors (2013-10-07) [ Power/Alternative Energy ]
Richardson reveals extrusion profiles from Wakefield-Vette (2013-10-07) [ Manufacturing/Packaging ]

Fraunhofer team finds way to mass produce lab-on-chips (2013-10-07) [ Manufacturing/Packaging ]
Ansys tech enables modelling of mm-wave for wireless comms (2013-10-07) [ EDA/IP ]
SIMTech initiatives reinforce mfg productivity for SG SMEs (2013-10-07) [ Manufacturing/Packaging ]
3D NAND market share to grow 5.2 per cent in 2014 (2013-10-07) [ Memory/Storage ]
Avoiding scope errors (Part 3) (2013-10-07) [ T&M ]

20W audio amp reduces mid-power stereo apps BoM cost (2013-10-04) [ Amplifiers/Converters ]
Express Logic releases ThreadX with downloadable app modules (2013-10-04) [ Memory/Storage ]
A*STAR, Red Hat to leverage open source for BA projects (2013-10-04) [ EDA/IP ]
Proactive health apps to push board, embedded systems market (2013-10-04) [ Embedded ]
3D printing breaking through concept, prototyping mould (2013-10-04) [ Manufacturing/Packaging ]

Lessons learned from TSMC's rise (2013-10-04) [ Manufacturing/Packaging ]
Xicanto unveils low cost LM-79 test program for LEDs (2013-10-04) [ T&M ]
Smart devices and the future of keyless entry technology (2013-10-04) [ Sensors/MEMS ]
The Internet of Things and its need for the human touch (2013-10-04) [ Networks ]
Avoiding scope errors (Part 2) (2013-10-04) [ T&M ]

Bluetooth IC from Toshiba geared for small-sized apps (2013-10-03) [ RF/Microwave ]
Flextronics expands energy infrastructure portfolio (2013-10-03) [ Manufacturing/Packaging ]
Origami-shaped antennas reconfigure through ambient energy (2013-10-03) [ RF/Microwave ]
Fibre-optic sensors help safeguard HK-mainland China railways (2013-10-03) [ Sensors/MEMS ]
Chipmakers tested by automotive market's marathon pace (2013-10-03) [ Manufacturing/Packaging ]

WPC member PowerbyProxi receives $4M from Samsung (2013-10-03) [ Networks ]
Online quoting service drastically cuts MPW quote time (2013-10-03) [ EDA/IP ]
Spray-based carbon nanotubes used to create low cost sensors (2013-10-03) [ Manufacturing/Packaging ]
Dual UART IP Core features deeper FIFOs, extended baud rates (2013-10-03) [ Processors/DSPs ]
Energy harvesting: Get something from nothing (2013-10-03) [ RF/Microwave ]

CAN booting process for Vybrid controller solutions (2013-10-03) [ Embedded ]
Blue Pearl Software Suite v.7.1 boasts CDC enhancements (2013-10-02) [ EDA/IP ]
MHL 3.0 receiver with HDCP 2.2 eases premium content delivery (2013-10-02) [ Processors/DSPs ]
Researchers in Singapore, MIT develop flexible ceramics (2013-10-02) [ Manufacturing/Packaging ]
DRAM spot prices across the board shoot up post-SK Hynix fire (2013-10-02) [ Memory/Storage ]

Apple sticks to usual design, pricing for iPhone 5c (2013-10-02) [ Optoelectronics/Displays ]
R&S bolsters power characterisation options for scopes (2013-10-02) [ T&M ]
Team up aims to integrate solar films into building facades (2013-10-02) [ Optoelectronics/Displays ]
Researchers demonstrate carbon nanotube powered computer (2013-10-02) [ EDA/IP ]
Nordic combines ANT+, Bluetooth low energy in latest SoC (2013-10-02) [ RF/Microwave ]

Avoiding scope errors (Part 1) (2013-10-02) [ T&M ]
Using rational ClearCase in CodeWarrior 10.3 (2013-10-02) [ Embedded ]
Toshiba introduces unipolar stepping motor drivers (2013-10-01) [ Controls/MCUs ]
AOI camera module from Viscom flaunts 3D tech (2013-10-01) [ T&M ]
A*STAR speeds up commercialisation of nanoimprinting foundry (2013-10-01) [ Manufacturing/Packaging ]

OLED efficiency enhanced by wagon-wheel shaped molecule (2013-10-01) [ Optoelectronics/Displays ]
Teardown: Galaxy Note 3 still king of phablets (2013-10-01) [ Optoelectronics/Displays ]
DOCSIS 3.1 deals cable operators with design challenges (2013-10-01) [ Networks ]
Radar, vision sensing to enhance automotive safety (2013-10-01) [ Sensors/MEMS ]
3D sensor technologies ready for consumer space expansion (2013-10-01) [ Sensors/MEMS ]

Digital oscilloscope boasts trigger unit, analogue front end (2013-10-01) [ T&M ]
Create analogue interfaces for low power design (2013-10-01) [ Power/Alternative Energy ]
FreeMASTER serial driver implementation (2013-10-01) [ Embedded ]

--- Total 83 records ---

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