2013-11-11-20 Article review

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Article review (Sorted By Date)

Yole: Diamond materials market for chips to top $43M (2013-11-20) [ Manufacturing/Packaging ]
Gameloft, MediaTek to take mobile gaming to the next-level (2013-11-20) [ Processors/DSPs ]
Smart card offers security for banking, eGov markets (2013-11-20) [ Controls/MCUs ]
TI's low-power ICs to enable energy harvest design apps (2013-11-20) [ Power/Alternative Energy ]
APAC Big Data market to grow 34% CAGR from 2012-2017 (2013-11-20) [ Memory/Storage ]

Five MEMS devices unveiled at MEMS Exec Congress (2013-11-20) [ Sensors/MEMS ]
Taking a look at the embedded vision market (2013-11-20) [ Sensors/MEMS ]
South Korean firm puts up foundry biz for sale (2013-11-20) [ Manufacturing/Packaging ]
Nvidia, IBM take on enterprise-scale supercomputing (2013-11-20) [ Processors/DSPs ]
Micron, Intel, Nvidia battle in high-end processors market (2013-11-20) [ Processors/DSPs ]

Match LED driver architecture with the application (2013-11-20) [ Optoelectronics/Displays ]
Evaluation board for BGU8011 GNSS (2013-11-20) [ RF/Microwave ]
JTAG Technologies expands boundary-scan testers (2013-11-19) [ T&M ]
NFC tag enables smarter consumer, industrial devices (2013-11-19) [ RF/Microwave ]
Crystal oscillators support up to 700MHz frequency (2013-11-19) [ RF/Microwave ]

MIT researchers use viruses to boost Li-air cell performance (2013-11-19) [ Power/Alternative Energy ]
ROHM offers PMICs aimed at Intel Bay Trail I platform (2013-11-19) [ Power/Alternative Energy ]
Microsoft to join elite rank of chip buyers with Nokia buy (2013-11-19) [ Manufacturing/Packaging ]
Smartphone display technologies dissected (2013-11-19) [ Manufacturing/Packaging ]
Industrial Internet consortium to debut by Jan next year (2013-11-19) [ RF/Microwave ]

Picking out FETs for hot-swap source connection (2013-11-19) [ Power/Alternative Energy ]
Guide to quick start up of PNEV512B Board (2013-11-19) [ EDA/IP ]
Skyrmions could power high-density magnetic data storage (2013-11-18) [ Memory/Storage ]
Stationary battery market for telcos to hit to $3B in 2017 (2013-11-18) [ Power/Alternative Energy ]
Cloud service brings rain on NAND flash parade (2013-11-18) [ Memory/Storage ]

Acromag expands USB-configured process transmitter line (2013-11-18) [ Networks ]
Ultra-short laser deposition tech cuts materials costs (2013-11-18) [ Manufacturing/Packaging ]
Checksum, ECT unveil universal-probe test system (2013-11-18) [ T&M ]
Tsinghua's merger plan seen to boost China's chip industry (2013-11-18) [ Manufacturing/Packaging ]
Choosing DC-DC converter for space applications (2013-11-18) [ Power/Alternative Energy ]

Ams offers cost-efficient IC prototyping service (2013-11-15) [ Manufacturing/Packaging ]
Bergquist uncloaks thermally conductive gap filling (2013-11-15) [ Power/Alternative Energy ]
Polyester films cut hardcoat iridescence for touch sensors (2013-11-15) [ Sensors/MEMS ]
Toshiba expands wireless LAN SDHC memory cards (2013-11-15) [ Memory/Storage ]
Kyocera, Telenor Connexion partner to expand M2M offerings (2013-11-15) [ Embedded ]

ST MCUs promise security in next-gen mobile, consumer apps (2013-11-15) [ Controls/MCUs ]
Innovative LEDs light the path toward cheaper displays (2013-11-15) [ Optoelectronics/Displays ]
High smart device uptake ups wireless test equipment market (2013-11-15) [ T&M ]
NI teams up with Jakarta university for LabVIEW programme (2013-11-15) [ EDA/IP ]
Basics of ARM design on mbed IDE (Part 3) (2013-11-15) [ Processors/DSPs ]

BGA3018: 40-1006MHz push-pull application (2013-11-15) [ Amplifiers/Converters ]
Meller Optics extends sapphire portfolio (2013-11-14) [ Manufacturing/Packaging ]
Starter kit for embedded MPUs targets low cost HMI apps (2013-11-14) [ EDA/IP ]
Microsemi unveils advanced security IP block (2013-11-14) [ FPGAs/PLDs ]
AMD outs sol'ns for heterogeneous computing apps (2013-11-14) [ EDA/IP ]

TI's SDK aimed at low-power DSP + ARM devices (2013-11-14) [ EDA/IP ]
BASF to open electronic materials center in South Korea (2013-11-14) [ Manufacturing/Packaging ]
HSA Foundation welcomes new members (2013-11-14) [ Processors/DSPs ]
Fairchild foresees trillion sensors MEMS market: Part 2 (2013-11-14) [ Sensors/MEMS ]
Rohm first to blink, re-evaluates fuel cell focus (2013-11-14) [ Power/Alternative Energy ]

Integration trends for BLDC motor (2013-11-14) [ Sensors/MEMS ]
BGA3018: 40-2600MHz wideband amp application (2013-11-14) [ Amplifiers/Converters ]
High-reliability connectors boast up to 35% less footprint (2013-11-13) [ Networks ]
Pentek unveils 2-channel analog RF tuner (2013-11-13) [ RF/Microwave ]
SoC processors boost Nvidia revenue in Q3 (2013-11-13) [ Processors/DSPs ]

Chinese SoC firm plans IPO to push mobile roadmap (2013-11-13) [ Processors/DSPs ]
Universal flash storage poised to replace e-MMC (2013-11-13) [ Memory/Storage ]
CSR, Mentor Graphics team up to cut OEM dev't time (2013-11-13) [ Manufacturing/Packaging ]
MIT team eases surface cooling under extreme heat (2013-11-13) [ Manufacturing/Packaging ]
CMOS image sensor for automotive view cameras (2013-11-13) [ Sensors/MEMS ]

Samsung's IoT plan involves Siri-like system (2013-11-13) [ Sensors/MEMS ]
Basics of ARM design on mbed IDE (Part 2) (2013-11-13) [ Processors/DSPs ]
Windows XP expiration pushes rethinking of industrial op'n (2013-11-12) [ Embedded ]
MEMS sensor supports six degrees of freedom (2013-11-12) [ Sensors/MEMS ]
MIPI Alliance sets up Sensor Working Group (2013-11-12) [ Sensors/MEMS ]

Control, standardisation to bring SCADA systems to new heights (2013-11-12) [ Embedded ]
Nanostructures allow specific filtering of colours (2013-11-12) [ Optoelectronics/Displays ]
Analyst: MEMS market to exceed $22B by 2018 (2013-11-12) [ Sensors/MEMS ]
Nvidia, TI to bring next-gen HUD tech (2013-11-12) [ Optoelectronics/Displays ]
3D IC success hinges on major foundries (2013-11-12) [ Manufacturing/Packaging ]

Basics of ARM design on mbed IDE (Part 1) (2013-11-12) [ Processors/DSPs ]
Lifetime of BLF574XR in broadcast, ISM apps (2013-11-12) [ RF/Microwave ]
Industrial switch supports major real time Ethernet protocols (2013-11-11) [ Networks ]
Multilayer varistors tout 0.47 x 0.47mm footprint (2013-11-11) [ Power/Alternative Energy ]
MEMS motion-sensing tech for noise, power control (2013-11-11) [ Sensors/MEMS ]

MEMS, gesture recognition to transform mobile experience (2013-11-11) [ Sensors/MEMS ]
2013 top 20 IC supplier ranking to see major change (2013-11-11) [ Manufacturing/Packaging ]
ITO dominance to face competition in coming years (2013-11-11) [ Manufacturing/Packaging ]
Researchers develop cost-efficient inkjet-based circuits (2013-11-11) [ Manufacturing/Packaging ]
Fairchild foresees trillion sensors MEMS market (2013-11-11) [ Sensors/MEMS ]

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