2013-01-21-31 Article review - EE Times-Asia

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Jun 23,2016

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Article review (Sorted By Date)

Step attenuators tout frequency up to 67GHz (2013-01-31) [ T&M ]
Infineon unveils 'Coil on Module' chip package (2013-01-31) [ RF/Microwave ]
A*STAR, Physical Logic extend MEMS research team up (2013-01-31) [ Sensors/MEMS ]
RIM arms self with BlackBerry 10 in smartphone battle (2013-01-31) [ RF/Microwave ]
Open ecosystem team up spawns 3D IC (2013-01-31) [ Manufacturing/Packaging ]

MediaTek points out key DTV trends of 2013 (2013-01-31) [ Optoelectronics/Displays ]
Philips returns to lighting roots, drop CE business (2013-01-31) [ Manufacturing/Packaging ]
Scholars run computer sims to find efficient solar cells (2013-01-31) [ Power/Alternative Energy ]
EDA tools stunted due to lack of complaints, says Nvidia exec (2013-01-31) [ EDA/IP ]
SanDisk leans on Flash Forward for 1Y nm flash products (2013-01-31) [ Memory/Storage ]

Cisco banks on silicon photonics for 2.5D, 3D ICs (2013-01-31) [ Manufacturing/Packaging ]
Rectifiers from IR promise to ease design, cut cost (2013-01-31) [ Power/Alternative Energy ]
Conquering EMI challenges in automotives (2013-01-31) [ Sensors/MEMS ]
SoCs target smart poly-phase e-meters (2013-01-30) [ T&M ]
Mobile baseband chip integrates wireless connectivity (2013-01-30) [ RF/Microwave ]

Oscilloscope supports 20Gsps in 8-channel config (2013-01-30) [ T&M ]
Qualcomm, Imec team up on CMOS advancement (2013-01-30) [ Manufacturing/Packaging ]
High chip inventory burdens IC suppliers (2013-01-30) [ Manufacturing/Packaging ]
Intel readies mSATA SDD for Ultrabook apps (2013-01-30) [ Memory/Storage ]
Cadence unveils Virtuoso Advanced Node for 20nm (2013-01-30) [ EDA/IP ]

Prosperous years ahead for China IC market (2013-01-30) [ Manufacturing/Packaging ]
Nvidia adds Singapore university to CUDA program (2013-01-30) [ Processors/DSPs ]
Nano-positioning system uses magnetic levitation (2013-01-30) [ Manufacturing/Packaging ]
AndEBench benchmark tool updated, publishes results (2013-01-30) [ EDA/IP ]
Broadcom unveils enterprise SoC switches (2013-01-30) [ Embedded ]

Maximise general-purpose USB 3.0 device controller (2013-01-30) [ Interface ]
Imaging graphene via scanning electron microscopy (2013-01-30) [ T&M ]
Average mode LED driver touts ±2% current accuracy (2013-01-29) [ Controls/MCUs ]
1/f noise measurement system supports 1Hz-10MHz (2013-01-29) [ T&M ]
Phoenix-RTOS gets ported to eSi-RISC processors (2013-01-29) [ Processors/DSPs ]

M2M cellular modules to ship 100M units by 2015 (2013-01-29) [ RF/Microwave ]
Global PV installations to rise this year (2013-01-29) [ Power/Alternative Energy ]
Lumia not lifting Nokia high enough (2013-01-29) [ Manufacturing/Packaging ]
Researchers push for 'Li-Fi' Internet (2013-01-29) [ Optoelectronics/Displays ]
RFP planning wizard integrates VSS design tools (2013-01-29) [ EDA/IP ]

Kotura taps CMOS foundry for 100G photonics chips (2013-01-29) [ Manufacturing/Packaging ]
Ultra-low cost flexible display in dev't at UNIST (2013-01-29) [ Optoelectronics/Displays ]
Save power in LCD TVs with LED driving techniques (2013-01-29) [ Optoelectronics/Displays ]
Low voltage scanning electron microscopy films (2013-01-29) [ T&M ]
Apple stock plunges, Wall Street concerned (2013-01-28) [ RF/Microwave ]

Resistors offer 2-7W, 1-330Ω energy ratings (2013-01-28) [ Power/Alternative Energy ]
Femtosecond laser targets multi-photon microscopy (2013-01-28) [ Optoelectronics/Displays ]
MCUs boast embedded 512K flash, 64K RAM (2013-01-28) [ Controls/MCUs ]
CEVA, iOnRoad to offer personal driving assistance (2013-01-28) [ Embedded ]
IEEE 802.22-based TVWS base station prototype unveiled (2013-01-28) [ Networks ]

Power supply demand will drive IC growth boost (2013-01-28) [ Manufacturing/Packaging ]
Renesas' new MOSFETS boast 50% lower On-resistance (2013-01-28) [ Power/Alternative Energy ]
Diode LDO regulators boast adjustable output voltage (2013-01-28) [ Power/Alternative Energy ]
Mouser, Ams finalize distribution deal (2013-01-28) [ Manufacturing/Packaging ]
Fit in large-capacity memory in advanced-node SoCs (2013-01-28) [ Memory/Storage ]

Characterising low-dielectric-constant films (2013-01-28) [ T&M ]
Research: Water, Si speed up hydrogen yield (2013-01-25) [ Manufacturing/Packaging ]
Ultrabooks strategic to increasing SSD shipments (2013-01-25) [ Memory/Storage ]
3-axis accelerometer features embedded MCU (2013-01-25) [ Sensors/MEMS ]
Synopsys boosts uptake of FinFETs (2013-01-25) [ EDA/IP ]

Smart homes to zone in on energy management (2013-01-25) [ Sensors/MEMS ]
AMD to focus efforts beyond PC market (2013-01-25) [ Manufacturing/Packaging ]
Rolith enlists AGC to dev't anti-reflective glass (2013-01-25) [ Manufacturing/Packaging ]
Market ready to make 500,000 outdoor small cells in 2013 (2013-01-25) [ Manufacturing/Packaging ]
ASIC prototyping platform ready for design partitioning (2013-01-25) [ FPGAs/PLDs ]

Low-cost HPC platform revs up multi-core tech (2013-01-25) [ Optoelectronics/Displays ]
Reduce power estimation time from weeks to hours (2013-01-25) [ EDA/IP ]
Program dev't using Command Expert with LabVIEW (2013-01-25) [ T&M ]
Global LTE subscribers in 2013 to grow twofold (2013-01-24) [ RF/Microwave ]
JTAG unveils PMBus IC programming solution (2013-01-24) [ EDA/IP ]

Atmel, Wasion to develop smart meter solutions (2013-01-24) [ Power/Alternative Energy ]
Uncertainty in DRAM market to persist this year (2013-01-24) [ Memory/Storage ]
Miracast vs. UltraGig battle continues to brew (2013-01-24) [ RF/Microwave ]
Intel to close branded desktop motherboards group (2013-01-24) [ EDA/IP ]
Imec, Cadence team up for DFT solution for 3D memory (2013-01-24) [ EDA/IP ]

25G optical board spec set by VITA group (2013-01-24) [ Optoelectronics/Displays ]
Discover the truth about analogue IP at 28nm (2013-01-24) [ EDA/IP ]
LTE-A test mobile supports Transmission Mode 9 (2013-01-23) [ T&M ]
Lattice upgrades FPGA design software (2013-01-23) [ EDA/IP ]
Comms processor operates from -40°C to 125°C (2013-01-23) [ Processors/DSPs ]

MEMS microphone market boom driven by Apple (2013-01-23) [ Sensors/MEMS ]
LED, 3D TVs flourish across ASEAN (2013-01-23) [ Optoelectronics/Displays ]
ST closes in on FDSOI deal with Globalfoundries (2013-01-23) [ Manufacturing/Packaging ]
Microtan chip capacitors boast high CV ratings (2013-01-23) [ Power/Alternative Energy ]
24bit ADCs offer on-chip, ultra-low noise PGA (2013-01-23) [ Power/Alternative Energy ]

Growing digital power market to quadruple by 2017 (2013-01-23) [ Manufacturing/Packaging ]
Leaner PLX Technology forges on (2013-01-23) [ Networks ]
Analysis: Reinventing 'big-little' (2013-01-23) [ EDA/IP ]
Key ADC specs for system analysis (2013-01-23) [ Amplifiers/Converters ]
Reducing measurement uncertainty (2013-01-23) [ T&M ]

Interface-converter bridge LSI aimed at LCDs (2013-01-22) [ Interface ]
Solar module boasts 16.9% efficiency (2013-01-22) [ Power/Alternative Energy ]
TI MCU comes with USB 2.0 (2013-01-22) [ Controls/MCUs ]
Phase-change material opens new path for data storage (2013-01-22) [ Memory/Storage ]
Graphene market set for an explosive growth in 2020 (2013-01-22) [ Manufacturing/Packaging ]

ASEAN prime IT, telecom market (2013-01-22) [ RF/Microwave ]
Renesas aims to optimise personnel structure (2013-01-22) [ Processors/DSPs ]
Facebook: ARM server SoCs still fall short (2013-01-22) [ Memory/Storage ]
Molecular Imprints comes first in 450mm race (2013-01-22) [ Manufacturing/Packaging ]
NXP sees rich prospects for automotive future (2013-01-22) [ Manufacturing/Packaging ]

M2M communication: Enduring extreme conditions (2013-01-22) [ Networks ]
Chip makers expect slow but sunny year ahead (2013-01-21) [ Manufacturing/Packaging ]
Arasan rolls out NAND controller IP, PHY sol'n (2013-01-21) [ Controls/MCUs ]
Elliptic unveils multi-protocol security engine (2013-01-21) [ Processors/DSPs ]
Research: Optical fibre design cuts insertion loss (2013-01-21) [ Optoelectronics/Displays ]

Imec, PVA Tepla demo 3D TSV void detection (2013-01-21) [ Manufacturing/Packaging ]
Fraunhofer set to unveil sugar cube-sized spectrometer (2013-01-21) [ T&M ]
Infineon cracks entry level MCU market with new 32bit line (2013-01-21) [ Controls/MCUs ]
Acer continues brand consolidation, folds up eMachines brand (2013-01-21) [ Manufacturing/Packaging ]
AP65200 DC-DC buck converter enhances light load efficiency (2013-01-21) [ Power/Alternative Energy ]

Examine soft-core processors for embedded systems (2013-01-21) [ FPGAs/PLDs ]
Block diagrams for 10 Gb/s BERT test systems (2013-01-21) [ T&M ]

--- Total 107 records ---

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