2015-01-21-31 Article review

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Article review (Sorted By Date)

10 predictions for Malaysia's telecom market (2015-01-30) [ RF/Microwave ]
Broadcom woos cable, over-the-air boxes (2015-01-30) [ RF/Microwave ]
One-inch optical module carries up to 300Gbit/s data (2015-01-30) [ Optoelectronics/Displays ]
Intel processor touts 60GHz wireless docking technology (2015-01-30) [ Controls/MCUs ]
China's antitrust issues threaten US semicon industry (2015-01-30) [ Manufacturing/Packaging ]

Toshiba's global TV business to face revamp (2015-01-30) [ Manufacturing/Packaging ]
EMC tester accommodates individual probes, IC pins (2015-01-30) [ T&M ]
Vishay debuts extremely-compact SPST analogue switches (2015-01-30) [ EDA/IP ]
2A load switches target consumer devices (2015-01-30) [ Power/Alternative Energy ]
Non-volatile memory IP claims notable die cost reduction (2015-01-30) [ EDA/IP ]

Smooth, uphill climb predicted for connected cars (2015-01-30) [ RF/Microwave ]
Quantum entanglement made possible by Italian team (2015-01-30) [ EDA/IP ]
How open OS transforms network lifecycle management (2015-01-30) [ Embedded ]
Examining the bottlenecks in virtualized networks (2015-01-30) [ Networks ]
NVM battle: When will choices be made? (2015-01-29) [ Memory/Storage ]

Global photonic sensors market to reach $15.2 billion by 2020 (2015-01-29) [ Sensors/MEMS ]
Spansion, Macronix end patent disputes (2015-01-29) [ Processors/DSPs ]
SMART Modular develops first DDR4 Mini-DIMMs (2015-01-29) [ Memory/Storage ]
UMC raises capex to lead in 28nm node (2015-01-29) [ Manufacturing/Packaging ]
Fujitsu to reinforce IoT, cloud business with new facilities (2015-01-29) [ Manufacturing/Packaging ]

LED area curing sol'n geared for electronics manufacturing (2015-01-29) [ Optoelectronics/Displays ]
Teledyne DALSA unveils CMOS X-ray detector (2015-01-29) [ T&M ]
Low-footprint power MOSFET drivers support high speed apps (2015-01-29) [ Power/Alternative Energy ]
Design solutions accelerate design signoff, analysis (2015-01-29) [ EDA/IP ]
How to secure the Internet of Things (Part 2) (2015-01-29) [ Embedded ]

Lattice Semiconductor to buy Silicon Image for $600M (2015-01-28) [ Manufacturing/Packaging ]
Is Taiwan's water shortage affecting TSMC, UMC? (2015-01-28) [ Manufacturing/Packaging ]
Harman acquires Red Bend, Symphony Teleca (2015-01-28) [ Manufacturing/Packaging ]
Will technology put humans out of work? (2015-01-28) [ Manufacturing/Packaging ]
Maxim departs from consumer MEMS, touch sensor markets (2015-01-28) [ Sensors/MEMS ]

Manufacturing boosts demand for safety sensors, switches (2015-01-28) [ Manufacturing/Packaging ]
Streamline supply chain by focusing on sub-tier 1 suppliers (2015-01-28) [ EDA/IP ]
Touch controllers support industrial apps (2015-01-28) [ Sensors/MEMS ]
Performing automatic ASIC-to-FPGA conversion (2015-01-28) [ FPGAs/PLDs ]
Preventing embedded PCB design defects (2015-01-28) [ Manufacturing/Packaging ]

Singapore logs 1.9 per cent drop in manufacturing output (2015-01-27) [ Manufacturing/Packaging ]
IT professionals turn to open source (2015-01-27) [ Embedded ]
Smart, specialised devices to drive evolution of IoT (2015-01-27) [ EDA/IP ]
MCUs minimise standby power down to 30% at 1MHz operation (2015-01-27) [ Controls/MCUs ]
Rising flash array uptake hits $11.3B in 2014 (2015-01-27) [ Memory/Storage ]

Power grids offer path to effective malware detection (2015-01-27) [ EDA/IP ]
Microsemi, ST team up for electric car charger (2015-01-27) [ EDA/IP ]
Self-encrypting SSDs to become de facto standard (2015-01-27) [ Memory/Storage ]
Measuring capacity vs bias voltage on MLCCs (2015-01-27) [ T&M ]
India woos US technology companies (2015-01-26) [ Manufacturing/Packaging ]

10 vital signs of the semicon industry (2015-01-26) [ Manufacturing/Packaging ]
Microchip reveals low-cost 3D gesture recognition sol'n (2015-01-26) [ Embedded ]
Microbial programming underscores high market potential (2015-01-26) [ EDA/IP ]
Cellular links for IoT arena pits LTE MTC against 2.5G (2015-01-26) [ RF/Microwave ]
1.7GHz ARM Cortex-A7 SoC cuts power usage down to 200mW (2015-01-26) [ Processors/DSPs ]

Powervation rolls VR12.5-compliant digital DC/DC controllers (2015-01-26) [ Power/Alternative Energy ]
SFP+ active optical cable promises lower power consumption (2015-01-26) [ Networks ]
Managing peak-to-average ratio (2015-01-26) [ Power/Alternative Energy ]
Schneider, Autodesk join forces for building management (2015-01-23) [ Manufacturing/Packaging ]
Partnership programme targets micro-location technology dev't (2015-01-23) [ Manufacturing/Packaging ]

B&B links legacy systems with industrial IoT (2015-01-23) [ Manufacturing/Packaging ]
Hitachi, Johnson Controls ink global HVAC joint venture (2015-01-23) [ Manufacturing/Packaging ]
Toshiba restructuring adds muscle to IoT biz (2015-01-23) [ EDA/IP ]
HDMI protection devices from ST target Ultra-HD devices (2015-01-23) [ Interface ]
Streamline embedded designs with virtual platforms (2015-01-23) [ EDA/IP ]

Altium adds features to enterprise data management platform (2015-01-23) [ EDA/IP ]
How to secure the Internet of Things (Part 1) (2015-01-23) [ Embedded ]
Renewable energy projects in Philippines get incentives (2015-01-22) [ Power/Alternative Energy ]
9 ways to achieve best practices in factory maintenance (2015-01-22) [ Manufacturing/Packaging ]
China outdoes Europe, Japan in fabless chip market (2015-01-22) [ EDA/IP ]

Microsoft breaks into AR with Windows 10 (2015-01-22) [ EDA/IP ]
Flash memory devices complete full chip erase in 35ms (2015-01-22) [ EDA/IP ]
Optical system promises more efficient generators, engines (2015-01-22) [ T&M ]
Memory VIP speeds up mobile design verification closure (2015-01-22) [ EDA/IP ]
Report: CMOSIS mulls IPO (2015-01-22) [ Sensors/MEMS ]

Inventory snag puts Walmart's supply chain on spotlight (2015-01-22) [ EDA/IP ]
Sub-threshold design challenges low-power paradigm (2015-01-21) [ Embedded ]
Science and business gap hampers technology transfer (2015-01-21) [ Manufacturing/Packaging ]
Mentor Graphics wins patent case against Synopsys (2015-01-21) [ RF/Microwave ]
Team up expedites large-size, inkjet OLED TV time-to-market (2015-01-21) [ Manufacturing/Packaging ]

BJB partnership adds muscle to Anglia's Cree connection (2015-01-21) [ Optoelectronics/Displays ]
IoT, sensor synergy key to driving the market forward (2015-01-21) [ Sensors/MEMS ]
Smart rotary encoders integrate MCU, custom ASIC (2015-01-21) [ Sensors/MEMS ]
Compact module packs 10 dies side-by-side in a 2 x 5 array (2015-01-21) [ Manufacturing/Packaging ]
Remtec adds features to direct copper bond substrate (2015-01-21) [ Manufacturing/Packaging ]

--- Total 82 records ---

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