Manufacturing/Packaging??
Rework BGAs for improved process yields
Keywords:rework? repair? bga? process yield? module removal?
The removal and replacement of Ball Grid Array (BGA) devices requires proper equipment selection, robust process control, and proper training of staff. Rework involves the following sequence of steps: BGA module removal, BGA site preparation, sol-der paste deposition, module replacement, and reflow.
View the PDF document for more information.
View the PDF document for more information.
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