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Manufacturing/Packaging??

Rework BGAs for improved process yields

Posted: 01 Dec 1998 ?? ?Print Version ?Bookmark and Share

Keywords:rework? repair? bga? process yield? module removal?

The removal and replacement of Ball Grid Array (BGA) devices requires proper equipment selection, robust process control, and proper training of staff. Rework involves the following sequence of steps: BGA module removal, BGA site preparation, sol-der paste deposition, module replacement, and reflow.

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