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STMicroelectronics, Dot Wireless to collaborate on solutions for 3G mobile phones

Posted: 15 Oct 1999 ?? ?Print Version ?Bookmark and Share

Keywords:stmicroelectronics? dot wireless? cdma? baseband chips? embedded protocol software?

STMicroelectronics and Dot Wireless Inc. have announced an alliance to co-develop integrated CDMA baseband chips and related technology for third-generation (3G) mobile phones.

Under the pact, a joint engineering team was formed to focus on the development of baseband intellectual property (IP), embedded protocol software and transceiver reference designs. The alliance plans to integrate Dot's technology for the IS-95 2nd-generation CDMA standard with the ST100 DSP architecture, 0.18?m CMOS technology, and extensive system IP.

"Our goal is to develop scaleable 3G platforms for bringing customer-specified products to market quickly. ST's diverse IP portfolio will mean system integration and differentiation for customers," said Mark Hopkins, U.S. director for ST's Wireless Division.

"Our proven IS-95 baseband design and embedded software products makes us a serious CDMA player. ST's strength as an SOC and advanced process semiconductor maker will give us the levels of integration, cost and performance we need to compete in 3G markets," said Rick Kornfeld, CEO and president of Dot.

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