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Surface mount soldering recommendations

Posted: 10 Nov 1999 ?? ?Print Version ?Bookmark and Share

Keywords:soldering? reflow soldering? zones? cool down state? cool stage?

The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability.

View the PDF document for more information.

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