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Surface mount soldering recommendations
Keywords:soldering? reflow soldering? zones? cool down state? cool stage?
The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability.
View the PDF document for more information.
View the PDF document for more information.
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