EDA/IP??
EDA tools for high-performance MCM
Keywords:eda? design reuse? multi chip modules? mcm? ceramics?
In this paper we discuss a high density interconnect design methodology and describe the Tanner MCM Pro integrated MCM and IC design environment which combines strong features of both IC and PCB approaches to EDA and addresses shortcomings of existing tools and design flows.
View the PDF document for more information.
View the PDF document for more information.
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