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Board assembly techniques for 0.4mm pin pitch surface mount packages

Posted: 03 Nov 1999 ?? ?Print Version ?Bookmark and Share

Keywords:qsop? soic? pcb? solder deposition? fine pitch solder deposition?

This note outlines the basic board assembly operation using fine pitch packages and provides detail on each portion of the operation as it pertains specifically to packages with 0.4mm pin pitch.

View the PDF document for more information.

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