RF modules for cellular/PCS handsets

17IIC-Taipei ? Conference Proceedings RF Modules for Cellular/PCS Handsets Introduction Similar to the explosive in the Internet services, demand for Cellilat and PCS services has been growing by leaps and bumps. As a result, from 1997 to 1998 worldwide handset production increased from 110 millions to 160 millions and the forecast for 1999 is close to 200 millionds.At that rate, handset produc- tion will out-run PC production by a factor of almost 2 to 1 this year. There are serveral driving forces: ? Cost of service is getting cheaper every year ? Quality of service is better with new digital GSM, CDMA andTDMA air interface standards than the older analog stan- dards ? Handsets are getting smaller, lighter and more feature rich evey six months A state-of-art handset measures less than 3-4 inch long and weights less than 4-5 ounces and provides the following fea- tures: ? Dual or triple frequency bands ? 4.5 hours talk time ? 200 hours standby time ? Phone book with more than 250 names ? Conference calls ? Call hold/Call wait ? Alternative line service ? Automatic world clock ? Two games, Tetris and Solitaire ? Easy access to the 20 lat- est numbers dialed, calls received or missed ? Advice of charging ? Fixed dialing numbers ? Call baring ? Calling line identification ? SIM application tool kit The competetive bat is raised every time a major handset supplier introduces a new model. To meet the challenges, handset manufacturers demand more and more from Dr. Charles Huang ANADIGICS, Inc. their component supplier. For radios, the Holy Grail si "Radio on a Single Silicon Chip". As much as it's desired, "Radio on a Single Silicon Chip"is not technically feasible because ? 110 DB selectivity requires passive filters such as SAW or dieletctric filters ? Long talk time requires GaAs power amplifiers and switches As a result, multi-chip modules (MCMs) which integrate differebt type of chips inside a single mechnaical housing be- come an attractive alternative. RF modules for handsets In figure 1, a CDMA PA module is presented. The module in- corporates GaAs IC, silicon transistor, chip resistors and ca- pacitors. It delivers 29 dBm output power at PCS frequencies. In figure 2, a SAW receiver module is presented. The mod- ule incorporates GaAs ICs and surface acoustic wave (SAW) filters and deliver superior performance for handset receivers. Summary RF module deliver optimal solutions for state of the art hand- sets. Figure 1: A CDMA PA Module 18 IIC-Taipei ? Conference Proceedings Figure2: A SAW Receiver Module