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Manufacturing/Packaging??

Design and fabrication of a high-speed multichip module

Posted: 17 Dec 1999 ?? ?Print Version ?Bookmark and Share

Keywords:mcm? multichip modules? software tools? midas? wafer sharing?

This paper will report on the design and fabrication of a Multichip Module (MCM) using affordable software tools developed by the company and fabricated through the MIDAS wafer sharing brokerage service of USC/ISI.

View the PDF document for more information.



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